Molex Releases Updated DDR4 DIMM Sockets

The aerodynamic socket features a through hole termination style and streamlined housing feature. Standard sockets are available in three termination styles — press-fit for solderless processes, surface mount technology for PCB (printed circuit board) trace routing and through hole for cost-effective applications.

All sockets meet JEDEC specifications and support UDIMMs, RDIMMs and LRDIMM memory applications for data, computing and networking services with a lower operating voltage than DDR3.

“Customers deploying enterprise-level server systems are looking for interconnect solutions that provide design flexibility and cost savings while enabling virtually fail-proof reliability through round-the-clock operation hours,” said Poon Wai Kiong, global product manager, Molex.  “By offering different styles and reducing the connector footprint for increased PCB space, Molex addresses these needs while offering superior electrical performance over the DDR3.  And our innovative new construction material helps significantly reduce yield loss for greater cost savings and faster delivery.”

For more information, visit Molex Incorporated.

Sources: Press materials received from the company and additional information gleaned from the company’s website.