Digital Engineering 24/7

Helping design and engineering professionals discover, evaluate and specify technologies and processes that shorten the design cycle and enable success.

POLYFLOW 3.11 Extends Its Complex Physics

By DE Editors  

July 4, 2007

By DE Editors

The newest version of the software for the analysis of polymer processing and glass forming from ANSYS, Inc. (Canonsburg, PA; ansys.com) offers multiple enhancements for a more user-friendly experience.

POLYFLOW 3.11 extends the library of viscoelastic models by adding the Leonov viscoelastic model and a simplified viscoelastic model for extrusion.

For thermoforming and blow-molding applications, this new version offers a simple thermo-mechanical stress capability to calculate deformations during cooling. Updates to the 3D adaptive meshing technique enhance the simulation of using glass.

The Leonov model has the ability to reproduce the complexity of the viscoelastic behavior, and the simplified viscoelastic model for extrusion is able to reproduce large die swell typical of viscoelastic flow using less memory than traditional models.

Two new options in polymer thermoforming and blow molding calculate deformation and stress after cooling. First, the software creates a 3D geometry out of the deformed shell and the calculated thickness, which then can be used for advanced shrinkage and warpage simulation with structural codes. Second, the user can conduct simple thermomechanical stress and deformation analyses directly in POLYFLOW.

Visit ansys.com for more information about POLYFLOW 3.11.

 

About DE Editors

DE Editors

DE's editors contribute news and new product announcements to Digital Engineering. Press releases may be sent to them via [email protected].

Follow DE
on Facebook
on Linkedin

Related Topics

Simulate   All topics
 

Subscribe

Subscribe to our FREE magazine, FREE email newsletters or both!

Join over 90,000 engineering professionals who get fresh engineering news as soon as it is published.

Subscribe today

 
 

From our Sponsors

Meltio Takes Metal Additive to the Next Level
Meltio's DED technology enables industries to tailor and customize their solutions to create & repair metal parts.
Easing the Transition from ETO to CTO with Configuration Lifecycle Management
Manufacturers are discovering that the Configure-to-Order (CTO) model provides significant benefits when it comes to customization.
Siemens + Altair = The Next Chapter in Design and Simulation
With its acquisition of Altair, Siemens creates a unified simulation portfolio combining generative design with high-performance computing and AI workflows.