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April 2026 Special Focus Issue: Generative Design
In this Special Focus Issue, Digital Engineering takes a look at how generative design solutions can be used across different types of design problems and with a variety of manufacturing approaches to accelerate design space exploration, and…
Electrum utilizes the 3DEXPERIENCE platform on the cloud to develop their new electric motorcycle
Electrum, a new brand of electric motorcycles, utilizes the 3DEXPERIENCE platform. Their mission is to support Indonesia’s shift to low-carbon, sustainable transport and to ultimately help the country’s government achieve its vision of net…
Rapidus Corporation, a Tokyo-headquartered semiconductor manufacturer, announced that it has struck an agreement with Siemens Digital Industries Software to produce 2nm products. According to the announcement, Rapidus and Siemens aim to jointly develop a process design kit based on Calibre, Siemens' software for integrated circuit (IC) design, verification, and fabrication.
"Through the creation of a reference flow utilizing products such as Calibre and [Siemens'] Solido, we will jointly build a future of semiconductor manufacturing that excels in reliability, speed, scalability and safety," said Mike Ellow, CEO of Siemens EDA, Siemens Digital Industries Software.
Rapidus touts the move as "a new approach that integrates the entire foundry process from design to manufacturing."
“Rapidus is dedicated to advancing the co-optimization of manufacturing and design and is committed to providing a design environment that dramatically speeds up the realization of customer needs for next-generation semiconductors. Our collaboration with Siemens will embody this mutual optimization,” said Dr. Atsuyoshi Koike, CEO of Rapidus.
Rapidus aims to significantly cut down the time to achieve its MFD (Manufacturability for Design) goals for the 2nm gate-all-around process, the next phase after the currently possible 3nm die shrink in chips.
Simcenter™ software, from Siemens Digital Industries Software, uniquely combines system simulation, 3D CAE and test to help you predict performance across all critical attributes earlier and throughout the entire product lifecycle. By combining…
Making the Case for Artificial Intelligence and Machine Learning in Engineering
In this paper, Siemens Digital Industries Software and Digital Engineering will provide an overview of how AI/ML-enabled software can improve design workflows, while also addressing common questions and concerns around implementing this technology in an engineering organization.
Kenneth Wong is Digital Engineering's resident blogger and senior editor. Email him at [email protected] or share your thoughts or suggestions at digitaleng.news/facebook.
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