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Semiconductors

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Synopsys to Acquire Simulation Leader Ansys
January 17, 2024
Semiconductor design technology will be integrated with Ansys physics and AI capabilities.
Renesas Buys Altium
August 2, 2024
The combination sets the foundation for Renesas and Altium to create an electronics system design and lifecycle management platform, the companies report.
Siemens Debuts Innovator3D IC
August 1, 2024
Product is a comprehensive multiphysics cockpit for 3D IC design, verification and manufacturing.
Renesas to Buy PCB Design Software Leader Altium
February 16, 2024
Renesas says its intent is to make electronics design accessible to broader market.
Synopsys to Acquire Simulation Leader Ansys
January 17, 2024
Semiconductor design technology will be integrated with Ansys physics and AI capabilities.
e-skin Flat ESD: For the Highest Level of Safety and Cleanliness in Cleanrooms
October 26, 2023
igus is adding an electrostatically dissipative variant to its almost particle-free e-skin flat cable carrier series.
First Cable Carrier Certified for Dry Cleanrooms
August 23, 2023
Test passed with the best possible result: E6.29 from igus receives innovative dry cleanroom certificate from Fraunhofer IPA for ISO Class 4.
The Fundamentals of Semiconductor Production
August 23, 2023
An overview of the chip-making process and the parts & procedures involved.
3D Systems Launches Materials Engineered for SLA and Figure 4 Platforms
July 25, 2023
Flame-retardant material addresses production applications with SLA.
uPI Leverages Ansys’ Multiphysics Tools for Chip Design
July 20, 2023
Ansys' predictive simulation insights enable uPI to accelerate R&D and improve electrical performance, company says.
New Ansys Tools Improve Semiconductor Design
June 23, 2022
Ansys Totem-SC and PathFinder-SC optimize power and reliability for automotive, 5G, and high-performance compute semiconductors.
Optomec’s 3D Printed Electronics Solution Increases 5G Signals by Up to 100%
October 26, 2021
Aerosol Jet Printed Interconnects boost mmWave wireless circuit performance, Optomec reports.
ventureLAB and Siemens Partner to Boost Canada’s Hardware Catalyst Initiative
July 6, 2021
This new partnership will provide companies participating in the Hardware Catalyst Initiative with access to a set of offerings from the Siemens Xcelerator portfolio.
Sponsored Content
3D Integrated Microelectronic Subsystems and Additive Manufacturing
June 30, 2021
New 3D printing technology enables more complex electrical routing for 3D integrated microelectronic subsystems.
Renesas Creates Ventilator System Reference Design for COVID-19 Pandemic
April 17, 2020
Customers can use system to design ready-to-assemble boards for medical ventilators.


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