Helping design and engineering professionals discover, evaluate and specify technologies and processes that shorten the design cycle and enable success.
May 20, 2026 · This expands global ASIC services expertise and aims to take on advanced AI, HPC, mobile and automotive projects.
May 15, 2026 · Solution brings advanced generative and agentic AI capabilities to the characterization flow built on Fuse EDA AI system.
May 12, 2026 · Aim is to lower barrier for smaller companies, startups and research institutions, Siemens reports.
April 23, 2026 · Developing “agent‑ready” digital and analog flows that integrate agentic AI.
February 5, 2026 · Acquisition extends Siemens’ EDA software portfolio with computational metrology and inspection to help chipmakers solve technical challenges in semiconductor manufacturing.
November 13, 2025 · This collaboration connects Additive Center’s semiconductor ecosystem expertise and supplier development capabilities with ASTM’s standards, qualification, and certification frameworks.
October 17, 2025 · The ADI Power Studio Planner tool enhances system-level power tree planning.
October 2, 2025 · Siemens and ASE have collaborated to validate 3Dblox workflows for three VIPack technologies.
September 26, 2025 · Purpose of collaboration is to power innovations using AI Flows and IP for TSMC advanced nodes and 3DFabric.
August 15, 2025 · Cre8Ventures’ Open Higher Education Program developed in collaboration with Arm and University of Southampton, Siemens reports.
August 4, 2025 · Goal is to boost development lead times, enhance traceability and drive quality improvements, Siemens reports.
July 25, 2025 · ST in agreement to buy NXP’s MEMS sensor business for up to US$950 million in cash, including US$900 million upfront and US$50 million, subject to completion of technical milestones, companies report.
July 24, 2025 · The scalability of mPower enables customers such as UMC to carry out more accurate analysis on larger layouts, Siemens reports.
June 26, 2025 · Rapidus teams up with Siemens to produce 2nm chips
June 24, 2025 · Innovator3D IC suite and Calibre 3DStress from Siemens can help overcome semiconductor design complexity challenges.
May 8, 2025 · Cadence products incorporate agentic AI into its tools to optimize throughput and accuracy, the company says.
November 25, 2024 · Ansys Government Initiatives—the U.S. national security division of Ansys—will work with industry, academic, and government organizations to produce mature prototypes to show the lab-to-fab concept.
August 2, 2024 · The combination sets the foundation for Renesas and Altium to create an electronics system design and lifecycle management platform, the companies report.
August 1, 2024 · Product is a comprehensive multiphysics cockpit for 3D IC design, verification and manufacturing.
February 16, 2024 · Renesas says its intent is to make electronics design accessible to broader market.
Digital Engineering June 2026
In the latest issue of Digital Engineering, we focus on automotive design innovations, including light and sound simulation, additive manufacturing applications. Our editors head to NVIDIA GTC and RAPID+TCT, and we investigate whether you can…
May 2026 Special Focus: Artificial Intelligence in Design and Simulation
In this Special Focus Issue, learn about the latest developments in the integration of artificial intelligence into engineering workflows.
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