The “Cool” Factor - Optimization of Thermal Performance
As IoT and other devices are being squeezed into tiny form factors, electronic designs are getting ever more complicated. Join us in this webinar as we discuss ways to optimize thermal performance by tweaking the following: air flow, component placement, heat sink performance and fan placement. Come see how you can optimize the thermal performance of your electronic designs, helping you get to market faster with better product.
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April 3, 2018
As IoT and other devices are being squeezed into tiny form factors, electronic designs are getting ever more complicated.
Join us in this LIVE webinar May 15 at 2 p.m. as we discuss ways to optimize thermal performance by tweaking the following:
- Air flow
- Component Placement
- Heat Sink Performance
- Fan Placement
Come see how you can optimize the thermal performance of your electronic designs. Helping you get to market faster with better product.
Download or learn more today
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Latest News
Stratasys and Joe Gibbs Racing Extend Two-Decade Partnership
SimScale, Hexagon Partner on Cloud-Native Access to Advanced Analysis
Siemens and PhysicsX Collaborate to Build Deep Physics Simulation
AddUp Achieves ASTM Additive Manufacturing Safety Certification
Materialise CEO Forecasts 2025 3D Printing Trends
Wankel Rotary Engine Launched by Advanced Innovative Engineering
All posts
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