March 1, 2017
Inside this issue
Too Hot to Handle, Too Bright to Watch
Thermal simulation of wearables must tackle tight corners, personal preferences and interdisciplinary communication issues.
Out of Classroom Curriculum
Student competitions prepare up-andcomers with the hands-on experience necessary to meet the challenges of next-generation engineering.
Understanding Load Paths
Diagram to help determine the nature of the load.
New Lenovo ThinkStation P410 Offers Xeon Processors
Mainstream performance at an entry-level price.
Portable and Affordable
The lightweight 15.6-in. Lenovo ThinkPad P50s mobile workstation features incredible battery life.
Put Engineering Collaboration Front and Center
Social media and concurrent software development lead to collaborative engineering procedures.
Energy Efficiency for Always-on Sensing
Technologies and techniques to reduce energy use in mobile, wearable and IoT devices.
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Latest News
MachineWorks and Productive Machines Ink Strategic Partnership
This collaboration aims to introduce efficiency in machining processes, the companies report.
OpenBOM Releases Major Update for Onshape
Look for new drawing features, simplified settings, and enhanced speed, company says.
Altair and Munich Technical School Partner on Quantum Computing
Research details solutions for several key challenges of quantum computing implementation.
@Xi Delivers AI Supercomputer to University of Wyoming
Not counting the CPU nodes, this new supercomputer power reaches up to 6.3 PetaFLOPS FP64/32 peak performance.
Ansys Teams Up with Microsoft and TSMC for Photonic Simulation
Companies collaborate to speed up simulation and analysis of silicon photonic components, according to Ansys.
BigRep Unveils the DRYCON Filament Dryer
Unit is also a storage, and annealing machine for industrial-strength parts.
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