Digital Engineering March 2022

The latest issue of Digital Engineering focuses on aviation design, 3D printing in space, rugged engineering workstations, and AI in design, along with a review of two different configurations of the HP ZBook Fury 15 G8 mobile workstation.

Inside This Issue:

Reaching for the Stars, Privately

Private enterprises set their sights on space travel.

Aerospace Digital Twins Gain Altitude

As digital twin capabilities expand, aerospace companies can gain more insight into the entire aircraft lifecycle.

3D Printing’s Space Odyssey

From on-demand parts production to extraterrestrial housing construction, 3D printing plays a central role in space exploration.

Take Flight Faster with 3D Printing

Emerging eVTOL aircraft developers turn to additive manufacturing for lightweighting and prototyping.

Extreme Environments Call for Rugged Workstations

Such systems populate a small—but necessary—segment of the workstation market. 

Artificial Intelligence: The New Math for Engineering Design?

Manufacturers are leveraging AI in design to get products to market faster.

A Tale of Two Laptops: HP ZBook Fury 15 G8 mobile workstation

DE looks at two configurations of HP’s top-of-the-line 15-in. mobile workstation.

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Latest News

NVIDIA AI Summit: AI Powers Everything, from Autonomous Cars to the Search for Alien Life
NVIDIA's Bob Pette credits Tensor Cores and CUDA as the catalysts for AI revolution

MachineWorks and Productive Machines Ink Strategic Partnership
This collaboration aims to introduce efficiency in machining processes, the companies report.

OpenBOM Releases Major Update for Onshape
Look for new drawing features, simplified settings, and enhanced speed, company says.

Altair and Munich Technical School Partner on Quantum Computing
Research details solutions for several key challenges of quantum computing implementation.

@Xi Delivers AI Supercomputer to University of Wyoming
Not counting the CPU nodes, this new supercomputer power reaches up to 6.3 PetaFLOPS FP64/32 peak performance.

Ansys Teams Up with Microsoft and TSMC for Photonic Simulation
Companies collaborate to speed up simulation and analysis of silicon photonic components, according to Ansys.

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