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Advantech Launches 10-in. Ultra Rugged Mobile Computer
July 2, 2009
Military-grade mobile computer has an Intel Core 2 Duo processor.
Magnacad Design Inc. Improves Native IronCAD Model and Texture Site
July 2, 2009
Native model repository site now faster and easier to navigate.
3Dconnexion 3D Mice now Supported by Dassault Systemes’ CATIA V5R19 SP4
July 2, 2009
3D mice can now be used in latest version of Dassault's PLM solution.
ANSYS Releases Icepak 12.0 Fluid Dynamics Simulation Software
July 2, 2009
New simulation advancements in electronics thermal management reduce engineering time.
Editor’s Pick: CAD/CAM System Reduces Process Times
July 1, 2009
Version 9.0 of CimatronE helps eliminate wasted time and wasteful processes.
CAD/CAM System Reduces Process Times
July 1, 2009
Version 9.0 of CimatronE helps eliminate wasted time and wasteful processes.
New NVIDIA GPU-accelerated Plug-ins Boost Adobe CS4 Performance
July 1, 2009
Plug-ins offered at discounted pricing for NVIDIA Quadro customers.
Corsair Launches New 128GB and 64GB Performance Series Solid State Drives
July 1, 2009
P128 and P64 SSDs deliver 220MB/second read speeds.
Saelig Introduces MSR165 Datalogger
July 1, 2009
Low-power shock and vibration logger is compact.
Mechdyne Releases Conduit V2.6 Software for Real-time 3D Visualization
July 1, 2009
Conduit V2.6 performance improvements boost speed.
Lattice Technology Signs as an Adobe Solution Partner
July 1, 2009
Will provide integrated solution for publishing 3D data from 3D XVL products to PDF.
Luxology Unveils Community-based Asset Sharing Website for modo
July 1, 2009
New content-sharing site allows designers to create and contribute.
Autodesk Uses NVIDIA GPU Computing to Bolster Moldflow Software Performance
July 1, 2009
Moldflow Insight 2010 plastic injection molding software distributes workload to GPU.
Tecplot: Relieving the Pressure in Calculating Flow Separation
June 30, 2009
Researchers relieve the pressure in calculating flow separation using Tecplot 360.
Leveraging Abaqus CAE During a Downturn
June 30, 2009
CAE and analysis-based design represent a technology to help you weather the economy.



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UC San Diego’s 3D imaging research allows Mercedes-Benz R&D North America (MBRDNA) to tap into the institutional research...

ESI Group Collaborates with Aberdeen Strategy on Virtual Prototyping
The collaborative effort, "Shift Left: The Value of Virtual Prototyping for Digital Transformation of the Product Development Lifecycle," is an...

Hewlett Packard Enterprise Launches Speed-Driven Supercomputer in Poland
Academic Computer Centre Cyfronet AGH's new Helios supercomputer will advance AI-driven scientific research in astronomy, medicine, and climate protection, HPE...

Energica Renews Collaboration With Siemens
Siemens will keep supporting Energica via 3D systems simulation and computational fluid dynamics methodologies from Siemens’ Xcelerator portfolio.

Maximize Workforce Efficiency: Using KnowledgeSmart to Identify Skill Gaps
Robust, integrated skill assessments connect your employees with the training that will have the greatest impact.

IronCAD 2024 Product Update 1 Released
IronCAD 2024 Product Update 1 (PU1) brings enhancements and product quality improvements across general modeling, sheet metal design, and collaboration capabilities, company...

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