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Engineering Computing


Eurocom Enables Customers to Choose Black Friday Discount
Promotion, which runs through November 27, 2023, is applicable to custom-built, user-upgradeable laptops.
NVIDIA’s Ethernet Networking Platform for AI Available Soon
End-to-end platform features latest NVIDIA Spectrum-X networking for customers to transform business wiith AI.
Lenovo Unleashes Performance-Built ThinkStation P8
The new system is powered by AMD Ryzen Threadripper PRO 7000 WX-Series processors and NVIDIA RTX graphics cards.
Eurocom Laptop Trade-in Program Enables Recycling and Discount
Customers can recycle their old laptops and get 25% off a new customizable and user-upgradeable laptop.
NVIDIA Introduces Generative AI Foundry Service on Microsoft Azure
The NVIDIA AI foundry service uses three elements—NVIDIA AI Foundation Models, NVIDIA NeMo framework and tools, and NVIDIA DGX Cloud AI supercomputing services.
Perfect Portable Productivity
The SideTrak Swivel 14 turns any laptop into a dual-screen workstation.
Xometry Leverages Google Cloud to Accelerate Manufacturing Digitization
Vertex AI will provide the horsepower to expand instant quote and fulfillment capabilities for Xometry marketplace.
Are CAD Users Finally Ready for Cloud?
A new PTC/Onshape survey finds cloud-based CAD gaining traction with users of cloud-native platforms reporting higher satisfaction.
Powerful but Pricey: HP Z4 G5 Workstation
HP updates its best-selling desktop workstation.
AMD Bolsters 3rd Gen EPYC CPU Lineup
Leading OEMs including, Cisco, Dell Technologies, Gigabyte, HPE, Lenovo and Supermicro showcase solutions powered by 3rd Gen AMD EPYC CPUs.
Monitor Modifications
Blacker blacks and fewer blues highlight workstation monitor trends.
The Future of Accelerated Engineering Computations
It’s important to understand the problem, and define it correctly to get the right results in the right time, DE Design and Simulation Summit presenter says.
The Challenges and Opportunities of AI for Additive Manufacturing
Keynote panel at the DE Design & Simulation Summit explores the potential for artificial intelligence to enhance design for additive. 
The Future of Engineering Computing at the Design & Simulation Summit
At the Oct. 26 virtual event, learn how to choose the right workstation, HPC and cloud resources for your engineering workflows.
Engineer’s Guide to Efficient Changeovers
Changeovers are key to any successful packaging operation. Inefficient changeovers slow down the entire production line, and waste both time and money. But there's no single way to go about making changeovers more efficient; it requires a multifaceted approach that...



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BOXX Workstations Bring AI to the Data Center
Multi-GPU AI systems purpose-built to accelerate engineering and AI design with computing power.

AMD Grows EPYC CPU Portfolio
The AMD EPYC 4004 Series CPUs offer enterprise-grade performance, scalability and modern security features powered by “Zen 4” architecture. 

NASA Picks Elementum 3D for Co-License of High-Temp Alloy
The 3D printable high-temperature metal superalloy material will be offered to OEMs of airplanes and rockets, according to Elementum 3D.

FREE WEBINAR JUNE 6, 2024: Battle of the Tech - Resin Rivals (SLA, P3™ and PolyJet)
In resin-based additive manufacturing, SLA, P3./DLP, and Poly Jet have emerged as contenders. But which one is the clear...

PLM Intended to be More Accessible with Teamcenter X Essentials
Teamcenter X Essentials enables businesses to access Teamcenter X SaaS solution for PLM that is part of the Siemens Xcelerator...

Simr, Formerly UberCloud, Kicks Off SimOps for Product Development
$20M in Series A funding will be used to bring simulation best practices from the world's top companies to design...

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