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Switch Architecture Offers 40Gbps Server and Storage Connectivity
Silicon architecture enables 120Gbps inter-switch connections, scalability, and adaptive routing.
8-Channel Temperature Modules Have Built-in Web Server
Accurate 24-bit measurement systems speed DA.
New Kubotek Software Validates and Compares 3D CAD Models
Prevents costly production errors.
MDTVISION Introduces PRELUDE V5 Inspect
Measuring and control software based on DS' CAA V5 architecture.
New Thermal Imager Measures for Long Distance
SolidCAM Launches SolidCAM2008 R12
Manufacturing solution offers more integration, automation features, and CAM functions.
Woven Systems Extends HPC Ethernet Fabric Product Line
Gigabit Ethernet edge switch combines with EFX 1000 for 10Gbps across 4000 edge ports.
CoolIT Systems Extends Liquid Cooling Technology for Workstations
CPU performance raised, noise levels lowered, and reliability enhanced.
Catapult Is a Deskside Launching Pad for Scalable Applications
72-processor compact Linux cluster advances HPC infrastructure.
FLUENT for CATIA V5 Enables More CFD Sims
FieldView V12 Supports Structural Analysis
EM Simulation Tool Puts ‘Optimal Design’ Within Reach, 2 in a Series
Bunkspeed’s New hyperShot Simplifies the Product Design Process
An image-rendering system that can bring in 3D computer aided design data for photorealistic images in seconds.
SIMULIA Offers Simulation Software with Abaqus for CATIA V5 Version 2.5
Advanced finite element analysis and simulation for the CATIA V5 environment.
New Modeling Software Released by T-Splines, Inc.
T-Splines 1.0 for Rhinoceros 3D helps designers generate organic models.



Latest News

PTC Releases Creo v11, Updates Creo+
This launch enables engineers to enjoy enhancements for electrification, composites, model-based definition, simulation-driven design and manufacturing, the company says.

CADENAS Announces Membership in Industrial Twin Association
The IDTA is the first point of contact for all aspects of the standardized digital twin.

Hexagon Announces Leadership Appointments
Hexagon Asset Lifecycle Intelligence Division appoints senior leadership.

Ingersoll Rand Leads $19M Financing Round for Inkbit
Inkbit will use funding to advance to multifunctional additive manufacturing.

CAD Users Embrace Hybrid Modeling
Subdivision modeling gaining ground in production phase surface modeling.

ESTECO International Users’ Meeting Announces Agenda
The early June meeting, to take place in Italy, includes keynotes from Toyota, Eaton and more.

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