DE · Topics · Components


Zuken, CADENAS and ECAD-Port to Cooperate on Component Library
Zuken has signed a partnership agreement with CADENAS, a provider of online component libraries, and ECAD-Port, a specialized provider for electrical components library services.
Telit Introduces GNSS Location Module
A module simplifies the development process for wearables, personal trackers, and other battery-dependent applications, company reports
Pasternack Introduces New Coaxial Voltage Variable Attenuators
They can be used for electronic warfare, microwaves and other RF applications.
Exar Corporation Releases Triple-Channel Universal PMIC
The device can support FPGAs and SoCs.
E+E Electronik Releases Humidity and Temperature Sensors
The products offer good long-term stability under harsh conditions, the company states.
Molex Acquires Interconnect Systems
The company is a producer of high density silicon packaging.
Toradex, Gumstix Partner for Online Design-to-Order Service
Geppetto now supports the Colibir iMX6 development board.
USB Type-C: Simplicity and Complexity All in One
The protocol simplifies consumer usage but presents new challenges for engineers.
Sensirion, Digi-Key Enter Distribution Agreement
The worldwide agreement brings Sensirion's CMOSens technology to Digi-Key.
MEMSIC Launches MMC3630KJ Magnometers
The series targets mobile device designers and manufacturers.
TT Electronics Announces TPL Series
The sensors are ideal for industrial automation and instrumentation sectors.
OMEGA Introduces New Enhanced Data Loggers
They are suited for temperature and humidity data collection.
EnOcean Announces 2.4GHz Portfolio
The devices can help implement systems such as ZigBee.
Trenz Electronic Ships TE0808 SoM
The system on module is based on the Xilinix Zynq UltraScale+ MPSoC.
Saelig Becomes EXOSTIV Distributor
The company will be distributing the lab's line of FPGA for debugging environments.

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WIN Enterprises Announces the MB-65040 Mini-ITX with Intel Scalable Skylake Processor
MB-65040 supports the Intel Skylake-S CPU and Intel H110 chipset.

Auburn University Deploys $1.5 Million Digital X-Ray CT System for Additive Manufacturing Purposes
Customized system enables layer-by-layer quality assessment in real time.

CONTACT Software Issues CONTACT Elements Release with Software Modules
Users can benefit from comprehensive functional enhancements and the integration of agile processes.

Mobile Analysis 3D and 2D CAD Viewer “to Go” Now on Market
The CoreTechnologie 3D_Analyzer Viewer is now available through a mobile license-lending feature.

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