3D Systems Issues a COVID-19 Call to Action
March 24, 2020
3D Systems is offering its services, and is reaching out to its customers and partners to join the company in sharing resources.
Zuken, CADENAS and ECAD-Port to Cooperate on Component Library
November 20, 2018
Zuken has signed a partnership agreement with CADENAS, a provider of online component libraries, and ECAD-Port, a specialized provider for electrical components library services.
Telit Introduces GNSS Location Module
May 30, 2017
A module simplifies the development process for wearables, personal trackers, and other battery-dependent applications, company reports
Pasternack Introduces New Coaxial Voltage Variable Attenuators
August 23, 2016
They can be used for electronic warfare, microwaves and other RF applications.
Exar Corporation Releases Triple-Channel Universal PMIC
May 24, 2016
The device can support FPGAs and SoCs.
E+E Electronik Releases Humidity and Temperature Sensors
April 25, 2016
The products offer good long-term stability under harsh conditions, the company states.
Molex Acquires Interconnect Systems
April 15, 2016
The company is a producer of high density silicon packaging.
Toradex, Gumstix Partner for Online Design-to-Order Service
April 7, 2016
Geppetto now supports the Colibir iMX6 development board.
USB Type-C: Simplicity and Complexity All in One
April 1, 2016
The protocol simplifies consumer usage but presents new challenges for engineers.
Sensirion, Digi-Key Enter Distribution Agreement
March 28, 2016
The worldwide agreement brings Sensirion's CMOSens technology to Digi-Key.
MEMSIC Launches MMC3630KJ Magnometers
March 24, 2016
The series targets mobile device designers and manufacturers.
TT Electronics Announces TPL Series
March 23, 2016
The sensors are ideal for industrial automation and instrumentation sectors.
OMEGA Introduces New Enhanced Data Loggers
March 11, 2016
They are suited for temperature and humidity data collection.
EnOcean Announces 2.4GHz Portfolio
March 11, 2016
The devices can help implement systems such as ZigBee.
Trenz Electronic Ships TE0808 SoM
March 7, 2016
The system on module is based on the Xilinix Zynq UltraScale+ MPSoC.
3DEXPERIENCE Platform Supports XVL 3D File Format
Native XVL on 3DEXPERIENCE platform for Japan now available after development with Toyota.
Editor’s Pick: Adding Images and CAD Files to Simulation
Hexagon’s ODYSSEE A-Eye enhances CAE for industrial solutions by making an array of new data sources available, the company...
Stratasys Creates 3D Printed Display Pieces for Paisley Park’s Exhibition
Exhibition is called The Beautiful Collection: Prince’s Custom Shoes and includes a piano, guitars and a 9-foot-tall pointillist image...
Right to Repair Movement Attracting Attention
Organizations look for ways to build sustainability into products and help consumers prolong device lifespans.
Editor’s Pick: Increased Flexibility for Simulation-Driven Design
Enhancements and new features focus on increased flexibility for various simulation-driven design...
Editor’s Pick: Unearth CAD Interoperability Updates
CAD Exchanger 3.10.1 is a toolkit for 3D CAD developers and end users.
Editor’s Pick: Direct conversion of CAD into AR/VR-ready meshes
Nextech AR Solutions CAD-to-POLY conversion solution is now being offered to CAD...
Editor’s Pick: Turnkey Binder Metal Jetting System for Machine Shops
The Shop System uses Desktop Metal’s Live Sinter technology, which, according...