According to a company press release, ISI uses a multi-discipline customized approach to improve solution performance, reduce package size, and expedite time-to-market for customers. It supplies OEMs (original equipment manufacturers) in industries such as automotive, aerospace, data storage, networking and high-performance computing.
“We are excited about the unique capabilities and technologies the ISI team brings to Molex. ISI’s proven expertise in high-density chip packaging strengthens our platform for growth in existing markets and opens doors to new opportunities,” says Tim Ruff, senior vice president at Molex.
For more information, visit Molex.
Sources: Press materials received from the company and additional information gleaned from the company’s website.

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