July 24, 2025 · The scalability of mPower enables customers such as UMC to carry out more accurate analysis on larger layouts, Siemens reports.
November 25, 2024 · Ansys Government Initiatives—the U.S. national security division of Ansys—will work with industry, academic, and government organizations to produce mature prototypes to show the lab-to-fab concept.
March 1, 2023 · Stanford researchers marry metal nanoclusters with common polymers to create better lightweight 3D printed protective lattices.
August 15, 2022 · Siemens was selected to participate in the Rapid Assured Microelectronics Prototypes Phase II initiative. RAMP is a program established by the U.S. Department of Defense.
January 22, 2018 · DARPA’s $200 million JUMP program aims to create a leap forward in U.S. electronics innovation.