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Microelectronics News and Resources

Siemens and UMC Collaborate

July 24, 2025 · The scalability of mPower enables customers such as UMC to carry out more accurate analysis on larger layouts, Siemens reports.

Ansys Government Initiatives Picked to Join Microelectronics Commons

November 25, 2024 · Ansys Government Initiatives—the U.S. national security division of Ansys—will work with industry, academic, and government organizations to produce mature prototypes to show the lab-to-fab concept.

Nanoscale 3D Printing Material Targets Microelectronics Applications

March 1, 2023 · Stanford researchers marry metal nanoclusters with common polymers to create better lightweight 3D printed protective lattices.

Siemens Picked by Microsoft for Microelectronics Program

August 15, 2022 · Siemens was selected to participate in the Rapid Assured Microelectronics Prototypes Phase II initiative. RAMP is a program established by the U.S. Department of Defense.

The Partnership Seeking to Jumpstart Microelectronics Innovation

January 22, 2018 · DARPA’s $200 million JUMP program aims to create a leap forward in U.S. electronics innovation.

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