Hybrid Work is Here to Stay
December 1, 2022
An HP Teradici survey flags the ability to deliver a productive employee experience as the greatest challenge to the hybrid work model.
Hybrid Work Calls for a Security Makeover
November 15, 2022
Now that hybrid work is firmly established in the post-pandemic era, companies are updating security architectures, gravitating to a new model built around Zero Trust.
FREE WEBINAR NOV. 29: How to Move Your Existing Engineering Applications to the Cloud
November 7, 2022
In this webinar, learn how many of the world’s leading organizations are moving their existing 3D and 2D product design software in centralized datacenters or to the cloud.
Remote Computing Platform Expands Flexibility
April 26, 2022
New HP Anyware software combines ZCentral Remote Boost and Teradici CAS features.
Workstations in 2022: Lessons Learned From Pandemic
December 15, 2021
New work setups require more data processing and peripheral support capabilities.
Case Study: Finding the Right Spot
October 1, 2021
When the pandemic struck, this midwestern manufacturer turned to the cloud to support its now remote design and engineering team. Now, there’s no turning back.
HP Acquires Remote Computing Platform Teradici
July 27, 2021
Acquisition will strengthen hybrid work offerings.
Edge Computing as Antidote to Remote Engineering Challenges
June 1, 2021
Cloud and edge, when used in combination, yield a novel, cost-efficient IoT deployment solution for smart products.
Quick Electromagnetic Analysis of PCB Design
Autodesk Fusion 360 Signal Integrity Extension by Ansys reduces costs and improves compliance.
Editor’s Pick: Major update for multiphysics simulation
COMSOL Multiphysics 6.1 update includes new simulation tools for audio technology and vehicle electrification.
Epic Games to Use HOOPS Exchange for CAD Import
Epic Games switches to HOOPS Exchange for handling CAD model import
Sculpteo Publishes Updated Report on The State of 3D Printing
In this 8th edition, there are indicators that 3D printing is moving towards greater sustainability.
Editor’s Pick: 3D printing at 25µm
Boston Micro Fabrication microArch S350 3D printer is the newest addition to...
Editor’s Pick: Bringing quality control to additive manufacturing
AM-QUALITY is a production line intelligent device to enable quality control monitoring...
Editor’s Pick: HPC simulation on any desktop
Siemens says the new addition provides instant-on, rapidly scalable cloud-based HPC for...
Editor’s Pick: Finite element analysis inside product design
PTC's cloud-native Onshape Simulation is a new finite element analysis (FEA) solver.