Altair Launches Altair Simulation 2021

This release brings a robust end-to-end electronic system design toolset to customers.

This release brings a robust end-to-end electronic system design toolset to customers.

The latest updates open up capability to develop complex products by simulating 5G connectivity, electronic board level performance, modern manufacturing processes and more. Image courtesy of Altair.


Altair's 2021 simulation software release is here. In addition to accelerated simulation of real-world product performance and expanded simulation-driven design for manufacturing functionality, this release brings a robust end-to-end electronic system design toolset to customers. The latest updates to these simulation solutions enable customers to develop complex products more profitably by simulating 5G connectivity, electronic board level performance, modern manufacturing processes and more.

All products are available through Altair Units, which gives customers easy access to Altair’s entire portfolio of software solutions.

End-to-end Electronic System Design

Altair’s new electronic system design toolset enables engineers developing smart, connected devices to collaborate on all aspects of physical, logical, thermal, electrical, and mechanical design. This accelerates a variety of applications, from more efficient printed circuit board (PCB) design review, verification, analysis, and manufacture to the design of motors, sensors, and actuators with simulation.

Altair’s new electronic system design toolset enables engineers to collaborate on all aspects of physical, logical, thermal, electrical, and mechanical design. Image courtesy of Altair.

Notable updates include:

  • improved simulation and optimization of wireless connectivity, including 5G and electromagnetic compatibility;
  • visual firmware development now supports more widely used microcontroller families;
  • more capabilities for PCB fabrication, assembly, and end-of-line testing; and
  • expanded workflows simplify and automate analysis of structural stress, vibration, thermal and drop-test performance for non-experts.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

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