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Why BOM Management Matters
Late product introductions and wasted time are a couple of the negative consequences of a problem oft preventable with more proactive bill of materials management practices.
Accellera Issues Standardization Initiative to Address Design Automation and Tool Interoperability for Functional Safety
Proposed working group established to determine industry interest for a standard to support a functional safety flow.
Scanfil Selects Siemens Opcenter to Digitalize Operations
Scanfil will use Siemens Opcenter Execution Electronics (formerly Camstar Electronics Suite) to improve manufacturing processes.
Altium Issues New Release of Altium Designer for PCB Design
The latest release, Altium Designer 20, offers major upgrades to the software’s unified design environment, user experience and PCB design capabilities. 
PWR Advanced Cooling Technology Chooses Velo3D to Print Heat Exchangers
PWR to explore new thermal management strategies through metal 3D printing across a range of heat exchanger applications in motorsport, battery cell, electronics, aerospace and automotive cooling.
Nano Dimension Presents Production-Grade Printed Capacitors for PCBs 
Capacitors 3D printed on the DragonFly system eliminate the need for assembly.
Kaelus Teams Up With ECSite to Offer Enhanced Support for Test Equipment
ECSite software solution provides test automation, data management and reporting of 4G/5G telecom infrastructure applications.
Why BOM Management Matters
Late product introductions and wasted time are a couple of the negative consequences of a problem oft preventable with more proactive bill of materials management practices.
Nano Dimension Introduces DragonFly LDM for Continuous Digital Manufacturing of Electronics
HENSOLDT tests the DragonFly LDM additive manufacturing technology and discusses the results.
Nano Dimension Sells DragonFly Additive Manufacturing System to Istituto Italiano di Technologia 
IIT is a research institution in Italy specializing in promoting technological development and higher education in science and technology. 
Samsung Electronics Selects Optomec’s Aerosol Jet for Next-Generation Electronics Production
Electronics producers are now using the aerosol jet process to print RF interconnects, replace wire bonds in IC packaging, print antennas directly onto electronics enclosures and create multi-layer, miniature circuits.
Future Facilities Celebrates 10 Years of Thermal Simulation
6SigmaET has evolved over the last 10 years and now incorporates advanced unstructured gridding technology, cloud-based solving and VR integration for the Oculus Rift.
ANSYS 2019 R2 Strengthens Digital Thread Between Design, Engineering and Manufacturing
Latest ANSYS release accelerates digital transformation across every industry.
Nano Dimension Collaborates with Harris Corporation for Space Project
Nano Dimension and Harris Corporation receive grant approval to create hardware to fly on the International Space Station.
Creating an Origami Sensor Array
The rise of the Internet of Things, the growing role of printed electronics and the increasing number of technologies that mimic nature have all shaped the system’s development.
Arena Solutions Offers Arena PLM for AWS GovCloud
New software release extends PLM and quality assurance.



Latest News

Oerlikon AM and Siemens Collaborate to Digitize Additive Manufacturing
The integration of Siemens’ Digital Enterprise Portfolio into Oerlikon’s software landscape in its AM production and R&D sites...

Oerlikon AM Partners With United Launch Alliance
Partnership will aid in manufacture of launch vehicle flight components.

Oerlikon Partners with United Launch Alliance
Partnership will aid in manufacture of launch vehicle flight components.

HP Debuts its Next-Gen HP ZCentral
Single-source remote workstation solution accelerates high-performance, complex workflows from any location.

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