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Why BOM Management Matters
Late product introductions and wasted time are a couple of the negative consequences of a problem oft preventable with more proactive bill of materials management practices.
Why BOM Management Matters
Late product introductions and wasted time are a couple of the negative consequences of a problem oft preventable with more proactive bill of materials management practices.
Nano Dimension Introduces DragonFly LDM for Continuous Digital Manufacturing of Electronics
HENSOLDT tests the DragonFly LDM additive manufacturing technology and discusses the results.
Nano Dimension Sells DragonFly Additive Manufacturing System to Istituto Italiano di Technologia 
IIT is a research institution in Italy specializing in promoting technological development and higher education in science and technology. 
Samsung Electronics Selects Optomec’s Aerosol Jet for Next-Generation Electronics Production
Electronics producers are now using the aerosol jet process to print RF interconnects, replace wire bonds in IC packaging, print antennas directly onto electronics enclosures and create multi-layer, miniature circuits.
Future Facilities Celebrates 10 Years of Thermal Simulation
6SigmaET has evolved over the last 10 years and now incorporates advanced unstructured gridding technology, cloud-based solving and VR integration for the Oculus Rift.
ANSYS 2019 R2 Strengthens Digital Thread Between Design, Engineering and Manufacturing
Latest ANSYS release accelerates digital transformation across every industry.
Nano Dimension Collaborates with Harris Corporation for Space Project
Nano Dimension and Harris Corporation receive grant approval to create hardware to fly on the International Space Station.
Creating an Origami Sensor Array
The rise of the Internet of Things, the growing role of printed electronics and the increasing number of technologies that mimic nature have all shaped the system’s development.
Arena Solutions Offers Arena PLM for AWS GovCloud
New software release extends PLM and quality assurance.
Pushing the Printed Electronics Envelope
The prospects are real, but we may have to wait a bit before we can experience the full benefit of additive manufacturing in electronics.
Altium Launches “Altium Academic Programs”
Programs offer free and low-cost software and support to students and educators, empowering the next generation of PCB designers and engineers.
Integrating Smart Design Under Pressure
How a small engineering team evolved from its traditional product design roots to embrace the complexity that comes with smart, connected products.
Siemens Launches Enterprise-Class Embedded Linux Solution
New enterprise-class binary Mentor Embedded Linux solution is a commercial distribution that is designed to reduce risk and accelerate productivity for medical, industrial, aerospace and defense application.
Siemens Camstar Electronics Suite Offers Smart Manufacturing Capabilities
Single software solution integrates Siemens’ Camstar and Mentor’s Valor manufacturing execution capabilities.
Ruggedized Electronics Require Special Attention
Meet the challenge of designing sensitive electronics for harsh environments.



Latest News

WIN Enterprises Announces the MB-65040 Mini-ITX with Intel Scalable Skylake Processor
MB-65040 supports the Intel Skylake-S CPU and Intel H110 chipset.

Auburn University Deploys $1.5 Million Digital X-Ray CT System for Additive Manufacturing Purposes
Customized system enables layer-by-layer quality assessment in real time.

CONTACT Software Issues CONTACT Elements Release with Software Modules
Users can benefit from comprehensive functional enhancements and the integration of agile processes.

Mobile Analysis 3D and 2D CAD Viewer “to Go” Now on Market
The CoreTechnologie 3D_Analyzer Viewer is now available through a mobile license-lending feature.

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