Ansys Joins Cloud Alliance
Combining electronic design automation (EDA) parallelism and cloud scalability, TSMC and its OIP Cloud Alliance partners are creating cloud-optimized design methodologies.
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April 27, 2023
Ansys has joined TSMC’s (Taiwan Semiconductor Manufacturing Co.) OIP Cloud Alliance to facilitate the deployment of fully distributed workflows for mutual customers. By moving toward the cloud interoperability of Ansys multiphysics solutions with TSMC’s technology enablement, customers can access full benefits of faster run times and elastic computing with major cloud vendors, Ansys reports.
Combining electronic design automation (EDA) parallelism and cloud scalability, TSMC and its OIP Cloud Alliance partners are creating cloud-optimized design methodologies to accelerate turnaround time of design tasks, Ansys notes. Ansys and other EDA partners will optimize their tools for multithreaded, fully distributed runs to best use cloud, while cloud partners will bring new virtual machines suitable for the EDA workload of integrated circuit designs.
“Our customers of all sizes are leveraging the cloud to boost productivity while designing in TSMC’s leading-edge technologies for new applications from high performance computing to mobile, artificial intelligence, networking, and 3D-IC,” says Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. “By welcoming Ansys as the latest member into our OIP Cloud Alliance, TSMC aims to make Ansys’ leading multiphysics signoff solutions available to all of our customers and help them bring their differentiated products to market sooner, with higher quality.”
Ansys was an early adopter of elastic cloud computing with its SeaScape big-data platform—a cloud-native data infrastructure designed specifically for EDA. Ansys RedHawk-SC was built to work with SeaScape (SC) and many other Ansys semiconductor tools have followed, including Ansys PathFinder-SC, Ansys Totem-SC and Ansys PowerArtist-SC.
“Ansys’ strategy for the future foresees an absolutely central role for cloud computing,” says John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. “We have invested heavily in cloud-enabled platforms that give our products clear advantages in speed and capacity over traditional tool environments that were not designed for the cloud.”
Sources: Press materials received from the company and additional information gleaned from the company’s website.
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