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Corsair debuted its new Corsair Cooling Hydro Series H50 high-performance CPU cooler at Computex 2009.
Working with ASEtek, a designer of liquid cooling systems for high-performance computing, Corsair has developed a CPU cooling solution that it says outperforms stock CPU coolers by more than 30 percent. Using a copper CPU cooling plate and integrated pump connected to a 120mm radiator and low-noise fan, the Hydro Series H50 delivers cooling for higher overclocking performance and greater stability. The H50 is a closed-loop system that is supplied pre‑filled and fully connected using low permeability tubing to nearly eliminate evaporation and leaking.
“Until today, most innovations in CPU cooling revolved around how to fit increasingly bulky and unmanageable heatpipe-based air coolers into a chassis,” says Jim Carlton, vice president of Marketing for Corsair, “The new Hydro Series H50 changes the game, packing an incredible amount of cooling into a much more compact solution and delivering better performance than even high-end, dual-fan CPU coolers that barely squeeze into a system.”
The Corsair Cooling Hydro Series H50 comes with the copper CPU cooling plate and pump unit, 120mm radiator and fan, and mounting brackets for both Intel LGA775 and Intel LGA1366 socket motherboards. Brackets for AMD socket AM2 and AM3 motherboards are available for a shipping and handling charge by contacting Corsair Technical Support.
The Corsair Cooling Hydro Series H50 will be available by the end of June.
For more information, visit Corsair Memory, Inc.
Sources: Press materials received from the company and additional information gleaned from the company's website.
DE's editors contribute news and new product announcements to Digital Engineering. Press releases may be sent to them via [email protected].
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