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Digital Engineering April 2026
In the latest issue of Digital Engineering, we take a look at the latest innovations in design for additive manufacturing, including the use of natural language inputs, social media cosplayers, and AI integration. The issue also includes a feature…
January Special Focus Issue: Design for Additive
In this Special Focus Issue of Digital Engineering, learn about the latest advancements in design for additive manufacturing, including new software tools, additive in automotive, custom medical devices, and more.
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The MicroAutoBox II is the next generation of dSPACE's compact rapid prototyping platform for in-vehicle use. It is used to perform fast function prototyping in fullpass and bypass scenarios.
MicroAutoBox II gives ECU function developers faster real-time computation of their controller models. This boost to processing power comes from a new processor board equipped with an IBM PowerPC processor running at 900 MHz.
In addition, MicroAutoBox II has a new host connection for direct connection to the host PC's Ethernet interface. Another Ethernet interface is for connecting MicroAutoBox II to external devices. This opens up potential uses in new application areas, such as driver assistance systems. To develop these systems, embedded PCs are often used for processing video data or controlling analog or digital displays.
dSPACE says it has made the MicroAutoBox's boot times even faster so that in ECU networks, MicroAutoBox II can perform immediate boot-up.
The models and cable harnesses from previous MicroAutoBox applications can still be used. Running the new MicroAutoBox II requires the installation of dSPACE Release 6.6. dSPACE is planning further versions of MicroAutoBox II with additional I/O variants for the end of 2010.
For more information, visit dSPACE.
Sources: Press materials received from the company and additional information gleaned from the company's website.
DE's editors contribute news and new product announcements to Digital Engineering. Press releases may be sent to them via [email protected].
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