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Kistler Announces New Manufacturing Process Monitoring Technologies

Latest solutions on display at Assembly and Automation Technology Expo 2011.

Latest solutions on display at Assembly and Automation Technology Expo 2011.

By DE Editors

Kistler has announced a number new technologies for assembly automation and manufacturing process monitoring, planned for display at the forthcoming Assembly and Automation Technology Expo, Sept. 20-22, 2011, at McCormick Place North in Chicago.

On display will be the company’s latest turnkey instrumentation solutions for manufacturing process monitoring and automation, as well as injection molding, including sensors, data acquisition systems and software. Technologies include process data collectors; electromechanical joining modules; a closed-loop monitoring system for servo press manufacturing; and Kistler’s latest developments in pressure, force, acceleration and torque sensing technologies.

New product and company announcements will include the Type 5630M process data collectors, the DMF-P A310 Universal Type 4740A force-displacement measurement system, the Type 2151B NC electromechanical joining modules with hollow shaft motor, and the CoMo DataCenter Type 2829B, a proprietary software designed for use with the Kistler CoMo Injection system.

Additional announcements include the Type 6184A miniature quartz mold cavity pressure sensors, the Type 6190 high-precision transducer, the establishment of a new technical sales support center in Novi, MI, as well as a fully dedicated sales and support facility in Monterrey, Mexico.

For more information, visit Kistler.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

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DE Editors

DE’s editors contribute news and new product announcements to Digital Engineering.
Press releases may be sent to them via [email protected].

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