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Siemens Digital Industries Software is collaborating with Advanced Semiconductor Engineering, Inc. (ASE), a provider of semiconductor manufacturing services in assembly and test, to develop 3Dblox-based workflows for the ASE VIPack platform using Siemens’ Innovator3D IC solution, which is certified for the 3Dblox standard.
Siemens and ASE have collaborated to validate 3Dblox workflows for three VIPack technologies, including Fanout Chip-on-Substrate, (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Through Silicon Via (TSV)-based 2.5D and 3D IC.
ASE’s VIPack is made up of six core packaging technology pillars supported by an integrated co-design ecosystem. As ASE’s advanced packaging platform, it is designed to enable vertically integrated package solutions and represents its next generation of 3D heterogeneous integration architecture that extends design rules and achieves high density and performance. The platform leverages advanced redistribution layer (RDL) processes, embedded integration, and 2.5D and 3D technologies.
“Siemens’ Innovator3D IC provides ASE with a rapid design assembly exploration cockpit that can read and write 3Dblox,” says Dr. CP Hung, vice president, Corporate R&D at ASE. “This collaboration allows ASE to optimize efficiency by developing 3Dblox definitions for some of our leading-edge VIPack technologies.”
3Dblox and Innovator3D IC enable System Technology Co-optimization (STCO) driven hierarchical device planning that is considered mandatory for chiplet-based heterogeneous integration using advanced packaging technologies such as those across ASE’s VIPack platform.
“Siemens has had a series of beneficial collaborations with ASE, and we are both committed to 3Dblox for semiconductor package design and verification, as it streamlines the design process and delivers open interoperability,” says AJ Incorvaia, senior vice president, Electronic Board Systems, Siemens Digital Industries Software.
To learn more about Siemens’ award-winning Innovator 3D IC software, visit https://eda.sw.siemens.com/en-US/ic-packaging/innovator3d-ic/.
Sources: Press materials received from the company and additional information gleaned from the company’s website.
Simcenter™ software, from Siemens Digital Industries Software, uniquely combines system simulation, 3D CAE and test to help you predict performance across all critical attributes earlier and throughout the entire product lifecycle. By combining…
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