Siemens and UMC Collaborate

Siemens Digital Industries Software has teamed up with United Microelectronics Corp. (UMC), a global semiconductor foundry, to implement Siemens' mPower software for electromigration (EM) and IR drop analysis.

The scalability of mPower enables customers such as UMC to carry out more accurate analysis on larger layouts and the Transistor-Level Pre-Layout EM and IR Drop capabilities enable early detection of potential issues.

After evaluation, UMC successfully used mPower's automated processes to perform comprehensive SRAM full-chip circuit analysis, delivering IR drop distribution assessments and enabling early-stage risk detection.

"By integrating Siemens' mPower into our design verification flow, we're enhancing our ability to identify and address potential issues earlier in the development cycle," says Osbert Cheng, vice president of device technology development & design support, UMC. "This aligns perfectly with modern design requirements and helps ensure superior product quality for our customers."   

Key benefits fromimplementation of mPower at UMC:  

• Accelerated time to market through scalability and verification. 
• Enhanced product reliability through early detection and resolution of potential issues. 
• Integration with existing design workflows, enabling power analysis. 

To learn more, visit https://eda.sw.siemens.com/en-US/ic/mpower/ 

Sources: Press materials received from the company and additional information gleaned from the company’s website.