Spatial Helps Esko Shift Packaging Design from 2D to 3D

Spatial and Esko, a global supplier of integrated solutions for packaging, sign and display finishing, commercial printing and professional publishing, have announced the latest release of ArtiosCAD 12 with functionality enabled by 3D InterOp from Spatial. ArtiosCAD includes dedicated tools specifically designed for packaging professionals for structural design, product development, virtual prototyping and manufacturing.

3D InterOp provides an extensible translation platform allowing 3D applications to reliably re-use external data. The integration enabled Esko to deliver a number of 3D import enhancements, including 50% faster performance for 3D model import, the selection of specific parts within an assembly for greater performance and usability, new support for the importing of SolidWorks, Parasolid, Unigraphics NX and Autodesk Inventor files, and exporting of IGES, STEP, ACIS and XCGM 3D files.

"Importing and exporting of native 3D models addresses an important pain-point for many of our customers, especially those in the consumer product goods and automotive segment," said Richard Deroo, product manager for structural design at Esko. "Adding this new functionality to ArtiosCAD based on technology from Spatial allows us to continue to add value to our packaging design solution, thus protecting our customers' investment and gaining new market opportunities."

For more information, visit Esko and Spatial.

Sources: Press materials received from the company and additional information gleaned from the company's website.