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Supermicro, Inc. announces the new FlexTwin family of systems. Featuring flexible support for the latest CPU, memory, storage, power and cooling technologies, FlexTwin is built to support high-performance computing (HPC) workloads. These systems are cost-optimized for performance per dollar and can be customized to suit specific HPC applications and customer requirements thanks to Supermicro's modular Building Block Solutions design.
"Supermicro's FlexTwin servers set a new standard of performance density for rack-scale deployments with up to 96 dual processor compute nodes in a standard 48U rack," says Charles Liang, president and CEO of Supermicro. "At Supermicro, we're able to offer a complete one-stop solution that includes servers, racks, networking, liquid cooling components, and liquid cooling towers, speeding up the time to deployment and resulting in higher quality and reliability across the entire infrastructure, enabling customers faster time to results.
Also, reportedly, up to 90% of the server generated heat is removed with the liquid cooling solution. For more information about FlexTwin systems, visit here.
This new multi-node design incorporates Supermicro's modular Resource Saving Architecture, which uses shared power supplies and DLC (downloadable content) of critical components to reduce raw materials usage, maximize power efficiency, and lower data center PUE (Power Usage Effectiveness). The new FlexTwin architecture includes new and industry standard technologies.
To support the deployment of the FlexTwin architecture at scale, Supermicro offers rack-scale integration services to design, build, validate, and deliver complete solutions of any size thanks to a manufacturing capacity of up to 5,000 racks per month (including 1,350 liquid cooled racks), rack-scale integration and testing facilities, and a suite of management software solutions.
Sources: Press materials received from the company and additional information gleaned from the company’s website.
DE's editors contribute news and new product announcements to Digital Engineering. Press releases may be sent to them via [email protected].
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