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What’s New in Simcenter Flotherm

Siemens shares latest updates for its electronics cooling software.

What’s New in Simcenter Flotherm
Source: Siemens
Simcenter Flotherm updates include numerous user-requested enhancements. Image courtesy of Siemens.

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By DE Editors  

May 19, 2023

Discover what’s new in the Simcenter Flotherm 2304 and Simcenter Flotherm XT 2304 electronics cooling software releases from Siemens Digital Industries Software that incorporates user-requested enhancements.

As part of the update, there is faster, easier CAD handling for computational fluid dynamics with MCAD Bridge Enhancements. There is Parasolid 3D modeling and new geometry import from Siemens NX, Solid Edge and others.

MCAD Bridge at Simcenter Flotherm 2304 now supports import from the following additional file types:

  • Siemens NX
  • Siemens Solid Edge
  • Parasolid
  • JT
  • PLMXML
  • XTXML

Voxelization Quality and Speed

Representing imported geometry with detail, engineers can now select the number of ray directions and options for handling faceted geometry better, according to Siemens, which adds that a higher number of ray directions helps better determine edges and facets for a more accurate voxelization solution. 

A step change in speed for voxelization has been delivered in Simcenter Flotherm 2304.

For a video on the MCAD Bridge module, click here.

Faster Pre-Solve Phase

A new re-engineered translator phase has been introduced in Simcenter Flotherm 2304, which is optimized for complexity.

Simcenter Flotherm XT 2304

For thermal designers, working in Simcenter Flotherm XT’s CAD-centric interface, there are a variety of enhancements to help with PCB thermal modeling.

Standalone Thermal Territories

Previously, Simcenter Flotherm XT established the value of component localized options for thermal modeling fidelity to provide accuracy for modeling copper and layers beneath components. This computational efficiency solution remains an alternative to explicitly modeling a whole board. 

For more details, click here.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

 

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Related Topics

Design   Electronic CAD   Products   Design   Electronics Cooling   Electronics Design   New Products   Siemens Digital Industries Software   All topics
 

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