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DE Editors · June 23, 2009 · Die analysis solution addresses requirements of manufacturing and automobile sectors.
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DE Editors · June 23, 2009 · Expanded family prints multiple materials simultaneously.
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DE Editors · June 22, 2009 ·
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DE Editors · June 22, 2009 · Attendees can bring a part file for analysis in VISI Flow 17.
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DE Editors · June 22, 2009 · Series designed to help infrastructure professionals stay abreast of best practices and technology.
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DE Editors · June 22, 2009 · Products include media, supplies, and accessories for cutters, engravers, and milling machines.
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DE Editors · June 22, 2009 · Helps product designers make decisions early in the product development process.
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DE Editors · June 22, 2009 · Online community includes biomedical experts.
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DE Editors · June 22, 2009 · Dassault Systèmes, Planit Holdings, CNC Software, and Cimatron named as leaders by research firm.
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DE Editors · June 22, 2009 · New workflows leverage functionality improvements in the fourth major release of modo.
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DE Editors · June 22, 2009 · Includes advancements in signal- and power-integrity, electromagnetic compatibility testing.
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Kenneth Wong · June 19, 2009 ·
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DE Editors · June 18, 2009 · Features automatic Cartesian grid generation and built-in post processing.
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DE Editors · June 18, 2009 · Anark Core creates bridge between 3D CAD and OpenFlight-based solutions.
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DE Editors · June 18, 2009 · Nuts, Bolts & Thingamajigs Foundation and SolidWorks Corp. award scholarships to 29 students.
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DE Editors · June 18, 2009 · Delivers reliability solution to manufacturers.
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DE Editors · June 18, 2009 · Customers can select parts and download 3D CAD models.
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Anthony J. Lockwood · June 17, 2009 · SpaceClaim enables analysis- and simulation-driven design by giving analysts tools that simplify model simplification, clean-up, and manipulation.
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DE Editors · June 17, 2009 · Korean defense company expands use of Product Development System.
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DE Editors · June 17, 2009 · Smaller companies can experience the benefits of PLM solutions with this lower cost alternative.