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November 20, 2017 · Expanded software toolset from Siemens integrates additive manufacturing, machining, robotics and quality inspection to digitalize part manufacturing
November 20, 2017 · BETA CAE Systems releases version 18.0.1 of its software suite with new tools and capabilities.
November 17, 2017 · Researchers at Brunel University London announced they have printed a flexible, wearable battery that can store energy without chemical reactions.
November 16, 2017 · One of the picks will be chosen as DE’s Editor’s Pick of the Week.
November 16, 2017 · The Perfactory 4 LED XXL from EnvisionTEC is a large DLP printer; the new Vida cDLM expands EnvisionTEC’s family of high-speed continuous printers to three models.
November 16, 2017 · 3D Systems also announces new additive manufacturing materials.
November 16, 2017 · Intel reports that it is enabling scalable performance for a broad range of HPC systems from the smallest clusters to the world’s largest supercomputers.
November 15, 2017 · New NI software suite aims to simply extract insights from mountains of data.
November 14, 2017 · New software solution combines the power of multi-material 3D printing with true voxel-level control enabling users to create advanced structures, gradient color patterns, internal properties and textures to fit precise material requirements.
November 14, 2017 · New Dell EMC PowerEdge C4140 accelerator-based platform for cognitive workloads, powered by NVIDIA GPUs and Intel Xeon Scalable processors, offers performance capabilities for machine and deep learning.
November 14, 2017 · The Equus SDX Platforms are Intel Xeon Scalable CPU-based white box 1U, 2U and 4U servers and storage chassis that provide densely integrated, cost-effective hardware configurations, according to the company.
November 14, 2017 · AMD combines this portfolio with software, featuring the new ROCm 1.7 open platform with updated development tools and libraries, enabling complete AMD EPYC-based PetaFLOPS systems.
November 13, 2017 · The new POD HPC cloud compute resources use Intel Xeon Gold 6148 processors, a cluster-wide Intel Omni-Path Architecture low-latency fabric.
November 9, 2017 · Ultimaker Cura 3.0 offers a new interface helping users prepare models for 3D printing. This software from Ultimaker is designed as a solution for professionals who have adopted 3D printing into their workflow, according to the company.
November 9, 2017 · The new overclocked APEXX S3 workstation from BOXX features new chassis, 8th generation Intel processor, and up to three professional graphics cards for 3D modeling, design and motion media.
November 9, 2017 · New 3D materials PA 11, PA 12 Glass Beads, and Polypropylene (PP) coming to HP’s Open Materials Platform; new partners Dressler Group and Lubrizol join HP’s 3D materials ecosystem.
November 9, 2017 · One of the picks will be chosen as DE’s Editor’s Pick of the Week.
November 9, 2017 · One of the picks will be chosen as DE’s Editor’s Pick of the Week.
November 8, 2017 · New solution combines surface damage analysis software with portable scanner.
November 7, 2017 · New HPE Superdome Flex elevates data analytics for complex workloads.
Digital Engineering June 2026
In the latest issue of Digital Engineering, we focus on automotive design innovations, including light and sound simulation, additive manufacturing applications. Our editors head to NVIDIA GTC and RAPID+TCT, and we investigate whether you can…
May 2026 Special Focus: Artificial Intelligence in Design and Simulation
In this Special Focus Issue, learn about the latest developments in the integration of artificial intelligence into engineering workflows.
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