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June 29, 2016 · New module automates and simplifies training management; helps ensure regulatory compliance.
June 28, 2016 · Version 2.8 includes co-site analysis features and a 64-bit GUI.
June 28, 2016 · The solution supports product assembly process studies with 3D models, the company states.
June 28, 2016 · The SHTW2 comes in a flip-chip package and has a footprint of 1.3x0.7x0.5 mm.
June 27, 2016 · The portfolio is suited for automotive, industrial and consumer applications.
June 22, 2016 · New version delivers hundreds of user-driven features and enhancements.
June 20, 2016 · The technology is suited for 3D data capture, inspection and reverse engineering applications.
June 20, 2016 · The technology is available in standard PCIe form factor and is suited for HPC and AI applications.
June 20, 2016 · The add-in provides two ways to import data.
June 17, 2016 · The release has hundreds of user suggested features, the company states.
June 16, 2016 · The money will go to research and developing end-to-end sensor solutions.
June 16, 2016 · The portfolio is designed to help test microwave circuits.
June 16, 2016 · The device does not require wires to operate.
June 15, 2016 · This program brings DWG-compatible CAD to smartphones and tablets.
June 14, 2016 · The portfolio is designed to address simulation and product complexity challenges.
June 9, 2016 · They are designed for CMM tactile scanning.
June 8, 2016 · New all-in-one workstation and solid-state drive option also now shipping.
June 7, 2016 · It is equipped with Intel Turbo Boost Max Technology, the company states.
June 7, 2016 · The goal is to help companies integrate augmented reality for multiple applications.
June 6, 2016 · This version has performance and speed improvements, the company states.