Alert!
Digital Engineering ceased publication on July 1, 2026. This website remains available as an archive of engineering content.
For inquiries or information, please email [email protected].
March 24, 2015 · The system has up to 32GB of memory and 3G/4G module support.
March 24, 2015 · The platform has added maps and expanded support for MCUs.
March 24, 2015 · The platform is part of the Teamcenter portfolio.
March 24, 2015 · The 30th release has updates for dimensioning, point clouds and overall ease of use.
March 23, 2015 · The devices are suited for operating in harsh environments.
March 23, 2015 · The software will be launched at RAPID 2015.
March 23, 2015 · HyperLynx can now support power-aware IBIS models and next-generation memory requirements.
March 23, 2015 · SOLS uses 3D printing to create insoles that custom fit its clients' feet, and has raised capital to sell direct to consumers.
March 20, 2015 · The platform has expanded capabilities and more partner applications.
March 20, 2015 · The devices can capture and keep ferrous wear and failure particles plus detect water in oil contamination.
March 19, 2015 · The devices are suited for smartphone, wearable and IoT applications.
March 18, 2015 · The technology will have mixed-precision computing and 3D memory.
March 18, 2015 · The companies have collaborated to create custom 3D-printed plastic optics.
March 18, 2015 · New features allow for the design and optimization of 3D-printed lattice structures.
March 18, 2015 · The company is also partnering with NVIDIA to develop a solution for 3D VDI applications.
March 17, 2015 · The technology is suited for graphics-intensive workloads.
March 17, 2015 · This addition enables users to simulate fiber-reinforced composites.
March 16, 2015 · The guides are available for USB connectors and cable assemblies.
March 16, 2015 · The company is also hosting its 35th annual users conference.
March 13, 2015 · The company is outfitting the system with a Samsung SM951 M.2 PCIe solid-state drive.