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Ansys

Editor’s Picks: Oct. 14-20, 2021
One of the picks will be chosen as DE’s Editor’s Pick of the Week.
Ansys Releases Metal Stamping Simulation Solution
Ansys Forming can streamline sheet metal forming processes.
Autodesk Highlights Fusion 360 Product Design Capabilities
Fusion 360 is Autodesk's cloud-based 3D modeling, CAD, CAM, CAE and PCB software platform.
OCT. 21 - FREE WEBINAR: How to Transition from Parametric to GD (Generative Design)
In this Hot Seat panel discussion, attendees will learn how to transition from parametric to generative design.
Ansys and Rockwell Automation Optimize Industrial Operations
Rockwell Automation's latest release of Studio 5000 Simulation Interface now connects to Ansys Twin Builder.
Dr. Brent Stucker Joins 3D Systems’ Leadership Team
Dr. Stucker was previously employed by Ansys, where he served as director of Additive Manufacturing (AM) and as distinguished engineer.
Ansys and IPG Automotive Accelerate Autonomous Vehicle Path to Market
New partnership integrates simulation technology from IPG Automotive with Ansys’ immersive autonomous driving simulation solutions.
DE Editors’ Chat: Rapid + TCT Conference, Ansys Indy Autonomous Challenge, 3D-Printed Bridge, More
DE Editors discuss traveling to Rapid + TCT Conference, virtual car race hosted by Ansys, use of simulation in the Olympics, a 3D-printed bridge made by 3X3D, more
Indy Race in Pixels: Autonomous Racing Teams Test Their Codes in Virtual Race
Simulation software maker Ansys hosts Indy Autonomous Challenge
Preparing for Predictable and Unforeseen Events
Pie Aeronefs discusses the decision-making process in aircraft design for an aerial race.
Editor’s Picks: July 22-28, 2021
One of the picks will be chosen as DE’s Editor’s Pick of the Week.
Women of Color STEM Awards Recognize Five Ansys Employees
Winners will receive awards in the categories of Technology All-Star, Technology Rising Star and Educational Leadership.
Ansys Cloud to Support AWS Arm-based Graviton2 Processors
AWS Graviton2 processors can be employed in Ansys semiconductor simulation products
Ansys 2021 R2 Accelerates Engineering Exploration, Collaboration and Automation
The latest release increases data visibility and reuse for materials, digital twin components, electronic components and compliance initiatives.
Ansys, Meggitt Partnership Takes Flight
Thermal Solutions Centre of Excellence (CoE) is aimed at solving thermal management challengers, including those related to heat exchangers.



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