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Electronics

Why BOM Management Matters
August 1, 2019
Late product introductions and wasted time are a couple of the negative consequences of a problem oft preventable with more proactive bill of materials management practices.
Nano Dimension Introduces DragonFly LDM for Continuous Digital Manufacturing of Electronics
July 26, 2019
HENSOLDT tests the DragonFly LDM additive manufacturing technology and discusses the results.
Nano Dimension Sells DragonFly Additive Manufacturing System to Istituto Italiano di Technologia 
July 15, 2019
IIT is a research institution in Italy specializing in promoting technological development and higher education in science and technology. 
Samsung Electronics Selects Optomec’s Aerosol Jet for Next-Generation Electronics Production
July 3, 2019
Electronics producers are now using the aerosol jet process to print RF interconnects, replace wire bonds in IC packaging, print antennas directly onto electronics enclosures and create multi-layer, miniature circuits.
Future Facilities Celebrates 10 Years of Thermal Simulation
July 1, 2019
6SigmaET has evolved over the last 10 years and now incorporates advanced unstructured gridding technology, cloud-based solving and VR integration for the Oculus Rift.
ANSYS 2019 R2 Strengthens Digital Thread Between Design, Engineering and Manufacturing
June 7, 2019
Latest ANSYS release accelerates digital transformation across every industry.
Nano Dimension Collaborates with Harris Corporation for Space Project
May 31, 2019
Nano Dimension and Harris Corporation receive grant approval to create hardware to fly on the International Space Station.
Creating an Origami Sensor Array
May 1, 2019
The rise of the Internet of Things, the growing role of printed electronics and the increasing number of technologies that mimic nature have all shaped the system’s development.
Arena Solutions Offers Arena PLM for AWS GovCloud
April 26, 2019
New software release extends PLM and quality assurance.
Pushing the Printed Electronics Envelope
April 1, 2019
The prospects are real, but we may have to wait a bit before we can experience the full benefit of additive manufacturing in electronics.
Altium Launches “Altium Academic Programs”
March 25, 2019
Programs offer free and low-cost software and support to students and educators, empowering the next generation of PCB designers and engineers.
Integrating Smart Design Under Pressure
March 1, 2019
How a small engineering team evolved from its traditional product design roots to embrace the complexity that comes with smart, connected products.
Siemens Launches Enterprise-Class Embedded Linux Solution
February 26, 2019
New enterprise-class binary Mentor Embedded Linux solution is a commercial distribution that is designed to reduce risk and accelerate productivity for medical, industrial, aerospace and defense application.
Siemens Camstar Electronics Suite Offers Smart Manufacturing Capabilities
February 4, 2019
Single software solution integrates Siemens’ Camstar and Mentor’s Valor manufacturing execution capabilities.
Ruggedized Electronics Require Special Attention
February 1, 2019
Meet the challenge of designing sensitive electronics for harsh environments.



Latest News

PTC Releases Creo v11, Updates Creo+
This launch enables engineers to enjoy enhancements for electrification, composites, model-based definition, simulation-driven design and manufacturing, the company says.

CADENAS Announces Membership in Industrial Twin Association
The IDTA is the first point of contact for all aspects of the standardized digital twin.

Hexagon Announces Leadership Appointments
Hexagon Asset Lifecycle Intelligence Division appoints senior leadership.

Ingersoll Rand Leads $19M Financing Round for Inkbit
Inkbit will use funding to advance to multifunctional additive manufacturing.

CAD Users Embrace Hybrid Modeling
Subdivision modeling gaining ground in production phase surface modeling.

ESTECO International Users’ Meeting Announces Agenda
The early June meeting, to take place in Italy, includes keynotes from Toyota, Eaton and more.

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