3D Systems Partners with Oerlikon for Metal Additive

3D Systems and Oerlikon AM announced the companies have entered a collaboration to scale metal additive manufacturing. Combining both organizations’ process and applications expertise with 3D Systems’ Direct Metal Printing platform and Oerlikon AM’s surface engineering capabilities will enable a faster path to market for applications in industries such as semiconductor and aerospace, the companies report. 

Oerlikon AM is acquiring its fourth 3D Systems DMP Factory 500 system, the first Oerlikon AM is adding in the United States, to be part of the manufacturing workflow in its North Carolina facility. This will help expand Oerlikon’s end-to-end supply chain solution for high-precision, complex aluminum components for the US market.

3D Systems’ Application Innovation Group (AIG) collaborated with Oerlikon AM’s Application Engineering to develop this solution. This workflow includes the DMP Factory 500, an industry-leading platform featuring a vacuum chamber to ensure the lowest O2 content, and a 3-laser configuration for the production of seamless large parts as large as 500mm x 500mm x 500mm. This results in the highest surface quality for metal 3D-printed parts with outstanding material properties.

“For our customers to remain competitive in core technology markets (including semicon and aerospace), scale up to series production is dependent upon the successful execution of application development, qualification, and timely ramp up to full-scale production,” says Jonathan Cornelus, business development manager, Oerlikon AM. “With Oerlikon and 3DSystems joining forces, this partnership will accelerate the industrialization of metal AM through an integrated team approach between the customer, printer OEM, and manufacturing partner. The efficiency gains will maximize the benefits of additive manufacturing across design, materials, printing, and post-processing to break performance barriers in the manufacturing supply chain.”

“Industries such as aerospace and semiconductor manufacturing require precision without compromise,” says Scott Green, solutions leader, 3D Systems. “Companies focusing on these areas require constant innovation to meet the accuracy, speed, reliability, and productivity demands of increasingly complex production. Bringing together the industry-leading technology and applications expertise of 3D Systems and Oerlikon AM is delivering increased quality, improved total cost of ownership, reduced time to market, and minimized supply chain disruption.”

Sources: Press materials received from the company and additional information gleaned from the company’s website.