Digital Engineering 24/7

Helping design and engineering professionals discover, evaluate and specify technologies and processes that shorten the design cycle and enable success.

New Version of QuickField FEA Software

QuickField 5.9 allows defining electrical conductivity as a function of temperature.

By DE Editors  

December 16, 2011

By DE Editors

The latest release of the QuickField FEA product allows users to define electrical connectivity as a function of the temperature for all materials involved into the DC
Conduction, AC Magnetic and Transient Electromagnetic analyses. The New Data Editor provides the user interface for entering data and displaying these functions  as plots.

Temperatures, which may affect the conductivity, could be defined as constants or formulas with coordinates and time. For AC Magnetic problems it is also possible to import the temperature field calculated in the linked Heat Transfer problem. This new feature complements the existing capability to import the Joule losses from AC Magnetics to Heat Transfer analysis. Together these be-directionally coupled problems could be iterated to achieve the accurate results for temperatures in conductors, heated by their currents.

The magnetic state import technology, introduced in the previous version of QuickField for DC magnetic problems only, is now extended to AC Magnetics, and is useful for simulating various devices including speakers and inductors.

For more information, visit QuickField.

Sources: Press materials received from the company and additional information gleaned from the company's website.

 

Latest in Finite Element Analysis FEA

About DE Editors

DE Editors

DE's editors contribute news and new product announcements to Digital Engineering. Press releases may be sent to them via [email protected].

Follow DE
on Facebook
on Linkedin

Related Topics

Simulate   News   Products   Finite Element Analysis FEA   All topics
 

Subscribe

Subscribe to our FREE magazine, FREE email newsletters or both!

Join over 90,000 engineering professionals who get fresh engineering news as soon as it is published.

Subscribe today

 
 

From our Sponsors

Meltio Takes Metal Additive to the Next Level
Meltio's DED technology enables industries to tailor and customize their solutions to create & repair metal parts.
Easing the Transition from ETO to CTO with Configuration Lifecycle Management
Manufacturers are discovering that the Configure-to-Order (CTO) model provides significant benefits when it comes to customization.
Siemens + Altair = The Next Chapter in Design and Simulation
With its acquisition of Altair, Siemens creates a unified simulation portfolio combining generative design with high-performance computing and AI workflows.