STAR-CCM+ v11.06 Now Available

Siemens PLM Software has launched STAR-CCM+ v11.06, which now introduces an Electronics Cooling Toolset (E-Cool). According to a company press release, E-Cool facilitates the creation and manipulation of electronics components for the thermal performance analysis of board and system level electronics devices. Parts such as fans, heatsinks, chips, and boards can be imported from industry-standard IDF files, or created in STAR-CCM+.

This toolset provides the following functionalities, according to Siemens PLM:

• For filtration, fluidized beds or biomass furnaces type of applications the Source Smoothing technique automatically smooths and coarsens the underlying computational fluid dynamics (CFD) mesh to make it more appropriate for DEM calculations.

• For applications like multiphase flow through nozzles and orifices, bubbly flow or counter gravity flow, the Adaptive Multiple Size Group Population Balance (A-MUSIG) allows users to accurately model flows where the dispersed phase of bubbles, droplets or particles has a varied population in terms of size.

• The new Simulation Tree Comparison feature increases usability by allowing the side-by-side comparison of the simulation setup from two different cases.

“This new capability allows engineers to focus their time on making the right decisions for improving the thermal efficiency of their electronics systems,” said Jean-Claude Ercolanelli, senior VP of Product Management at Siemens PLM Software. “It utilizes an entirely new concept for quickly managing and exploring their entire product design space to match their industrial engineering objectives.”

For more information, visit Siemens PLM Software.

Sources: Press materials received from the company and additional information gleaned from the company’s website.