Sustainable Simulation Power
AMD EPYC™ 7003 series processors with AMD 3D V-Cache™ technology boost Ansys simulation performance while cutting energy consumption in half.
Engineering Computing News
Engineering Computing Resources
June 13, 2022
As engineering models grow in size, and simulation and analysis tasks grow more complex, design engineers increasingly rely on high-performance computing (HPC) infrastructure to handle their simulation workloads. However, not all HPC resources are alike. It is critically important to match the right HPC architecture with specific software workloads to ensure optimum performance and efficiency.
That is why the partnership between AMD and Ansys has proven so valuable – the enhanced CPU architectures offered by AMD in its latest 3rd-generation EPYC 7003 family of processors with AMD 3D V-Cache technology can improve simulation throughput performance by as much as 80% for several key CAE workloads (see Note 2). This not only provides a significant boost for engineering productivity, but can also cut energy costs and help reduce an organization's carbon footprint.
AMD developed the new 3D V-cache EPYC 7003 series SKUs to accelerate CAE workflows in response to the growing demand for cache-sensitive compute, and the shifting cost-to-performance ratio of raw silicon. The challenge: increasing the cache of the Zen 3 architecture to boost performance without increasing the footprint of the processor or the cache latency.
AMD leveraged 3D die stacking to boost the performance of its EPYC CPUs without requiring any additional real estate on the motherboard. The AMD 3D V-Cache is the largest L3 cache available for any HPC and analytics workloads, providing 3x the cache compared to original products in the 7003 line. Best of all, users can upgrade their infrastructure without deploying new servers, performing new application updates, or rearchitecting the systems.
The combination of high L3 cache per chip (768 MB) and high memory bandwidth allows data to be fed to the CPU much more quickly. This accelerates the performance of applications for computational fluid dynamics (CFD), finite element analysis (FEA), and tasks such as crash simulations, as well as workloads in electronic design automation (EDA) and other fields.
According to a recent Ansys blog, the EPYC 7003 series enables up to an 80% improvement in large-scale CFD workloads like those run in Ansys Fluent and Ansys CFX. The new chips can improve FEA performance in Ansys LS-DYNA by as much as 50%. This performance extends to cloud environments as well – for example, Ansys customers can solve simulations faster, make better design decisions, and reduce computing costs on HBv3 virtual machines.
This increased performance can also enhance sustainability initiatives by reducing the number of required servers and the use of energy to perform larger numbers of simulations. An end user running CFD simulations could cut the number of servers required in half by migrating from an Intel Xeon environment to AMD EPYC 7003, while cutting power consumption by 49%. That provides a total cost of ownership savings of 51% over three years, while also cutting the number of cores (and associated software license costs) in half. (See Note 1.)
The new processor improvements apply across the suite of Ansys simulation and analysis products. For example, compared to a top of stack 40-core Intel 2P Xeon 8380 CPU, the AMD EPYC 7773X (64 cores) provides up to a 47% uplift for Ansys Fluent; a 69% uplift for Ansys LS-DYNA, and a 96% potential uplift for Ansys CFX. Outstanding leadership results are also seen at equal core counts, for a clear performance-per-core advantage. (See Note 3.)
AMD has worked closely with Ansys to ensure that end users have a full range of infrastructure options to meet their engineering workflow needs. The new EPYC CPUs with 3D V-Cache provide clear benefits for many CFD, FEA and EDA applications for no or a relatively low upgrade cost. For less cache-sensitive applications, users can choose standard 7003 series processors which continue to deliver exceptional leadership performance. AMD’s popular Optimizing CPU Libraries (AOCL) can be used to accelerate applications in CAE and other verticals to ensure optimal performance on AMD architecture. The two companies partnered for performance optimization of Ansys Mechanical on EPYC hardware, delivering gains of 1.26x geomean with gains as much as 2.12x. (See Note 4.) Ansys and AMD are continuing to work on complementary hardware and software solutions that will further accelerate explicit FEA and high frequency electromagnetics simulation and analysis.
Want to learn more? Watch the AMD Meet the Experts webinar with Ansys to hear more about how AMD EPYC processors can improve simulation performance. You can also download this infographic, which includes even more data on the benefits of the AMD 3D V-Cache technology when it comes to using Ansys products.
Note 1: To run 4600 airfoil_50M benchmarks per day with Ansys® CFX® it takes an estimated 10 2P AMD EPYC™ 7573X powered servers or 20 2P Intel® Platinum 8362 based servers. The EPYC 7573X solution has an estimated 50% fewer servers; 50% less RU space; 49% less power, with an estimated 50% lower 3-year TCO which includes both OS and application software. The EPYC 7573X solution saves an estimated 203.19 Metric Tons of CO2, which is an estimated equivalent carbon sequestration of 81 acres of US forests annually. Intel and Xeon are trademarks of Intel Corporation or its subsidiaries.
Note 3: AMD EPYC claims MLNX-009A, MLNX-029, MLNX-030 at www.amd.com/en/claims/epyc3x.