Digital Engineering 24/7

Helping design and engineering professionals discover, evaluate and specify technologies and processes that shorten the design cycle and enable success.

TE Innovation Summit Announces 2014 Call for Papers

Conference focuses on convergence of wireless networks, devices, service, and applications.

By DE Editors  

December 11, 2013

The 5th annual LTE Innovation Summit has issued a call for papers seeking presenters from all stages of the mobile wireless ecosystem. The 2014 LTE Innovation Summit will focus on the underlying technologies that are driving the convergence of wireless networks, devices, services and applications.  This year's areas of interest include LTE-Advanced; IMS; VoLTE; Rich Communication Suite (RCS) and positioning methods other than GPS to support location based services (LBS); Small Cells as part of Heterogeneous Network (HetNet) deployments; Smart Traffic Offloading and Beyond 4G communication systems.

The conference will be held at the Hilton San Diego/Del Mar on April 9-10, 2014.  Topics and presentation titles should be submitted by Dec. 20, with formal abstracts following on Jan. 17, 2014. Paper acceptance notifications will be issued Jan. 31, 2014, and full materials should be submitted by March 14.

Visit http://bit.ly/1cbcfgb to submit information.

For more information, visit the LTE Innovation Summit.

Sources: Press materials received from the company and additional information gleaned from the company's website.

 

Latest in Electronic Components

About DE Editors

DE Editors

DE's editors contribute news and new product announcements to Digital Engineering. Press releases may be sent to them via [email protected].

Follow DE
on Facebook
on Linkedin

Related Topics

Uncategorized   News   Electronic Components   All topics
 

Subscribe

Subscribe to our FREE magazine, FREE email newsletters or both!

Join over 90,000 engineering professionals who get fresh engineering news as soon as it is published.

Subscribe today

 
 

From our Sponsors

Meltio Takes Metal Additive to the Next Level
Meltio's DED technology enables industries to tailor and customize their solutions to create & repair metal parts.
Easing the Transition from ETO to CTO with Configuration Lifecycle Management
Manufacturers are discovering that the Configure-to-Order (CTO) model provides significant benefits when it comes to customization.
Siemens + Altair = The Next Chapter in Design and Simulation
With its acquisition of Altair, Siemens creates a unified simulation portfolio combining generative design with high-performance computing and AI workflows.