December 14, 2007 · Lightweight convertible tablet uses capacitive touch technology.
December 14, 2007 · Collaborate on next-generation semiconductor material and process development.
December 14, 2007 · Still in beta testing; release planned for 2Q08.
December 13, 2007 · Free application offers fast STL inspection and compression.
December 13, 2007 · Leios Mesh now available as stand-alone product.
December 13, 2007 · 3D Systems introduces new temperature-resistant material.
December 13, 2007 · Thinkreshape creates surfaces on point-cloud meshes.
December 13, 2007 · Roland milling systems build 3D overlays for tactile tablets.
December 13, 2007 · New FDM 900mc features large build chamber, improved accuracy.
December 12, 2007 · The MCA is suited for both laser scanning and touch-probe sensor uses.
December 10, 2007 · Cintiq 12WX and Cintiq 20WSX deliver pen-on-screen choices.
December 10, 2007 · RACKtangle doubles the number of I/O slots.
December 10, 2007 · Also expands support for programming languages, operating system, and workload management platforms.
December 10, 2007 · Software suited for geospatial imaging applications.
December 10, 2007 · Also characterizes environments for vibration analysis.
December 10, 2007 · Suited for information display and digital signage applications.
December 10, 2007 · More accurate structural analyses for plastics product designers.
December 10, 2007 · Plus, Magics 12 helps automate RP&M for professionals.
December 10, 2007 · Designed to enhance desktop connnectivity, speed disk drives.
December 10, 2007 · Includes module that extracts design intent from 3D scan data.