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May 14, 2015 · The company has also released a mobile workstation and sensor stand.
May 14, 2015 · The application provides an algorithm library for FPGAs and ASICs.
May 13, 2015 · The module can help simplify the antenna matching workflow, the company states.
May 13, 2015 · Cloud offering leverages the full ANSYS engineering application suite and enables consistent enterprise-wide workflows and data.
May 12, 2015 · The platform is now available in 64-bit for Windows, Macintosh and Linux.
May 12, 2015 · The company will start selling the platform through commercial channels later this month.
May 12, 2015 · The release includes cross-discipline collaboration, multiple user constraint management and support for global standards.
May 12, 2015 · The platform has enhancements for post-processing and overall speed.
May 11, 2015 · The technology can now support up to 12 devices simultaneously.
May 8, 2015 · The solution is powered by Amazon Web Services and is suited for 3D interactive graphics workloads.
May 7, 2015 · The kits enable users to create the ARM processor and memory elements in a virtual environment.
May 7, 2015 · The generation is suited for reverse engineering and production-part inspection.
May 7, 2015 · The applications expand access for the data exchange toolkit.
May 6, 2015 · Canon’s large-format Océ ColorWave 500 printing system prints, scans and copies in monochrome and color.
May 5, 2015 · The program is now more closely integrated with STAR-CCM+.
May 5, 2015 · The solution will be suited for Big Data analytic applications.
May 4, 2015 · The platform now includes automatic part matching and HexSight.
April 30, 2015 · The platform has added APIs, Ethernet timing and design features and overall speed improvements.
April 29, 2015 · The platform now has MPLAB co-simulation capabilities and expanded component support.
April 29, 2015 · Lowe’s is the latest company to roll out a 3D printing pilot program.