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June 23, 2015 · Tough Resin is designed for applications that require performance under stress and strain.
June 23, 2015 · The technology can reduce IoT device power consumption by 85%, the company states.
June 22, 2015 · The companies will develop a virtual validation program for additive manufacturing.
June 22, 2015 · The platform offers materials data interoperability between CAD and CAE.
June 18, 2015 · The platform now has several user-suggested features.
June 17, 2015 · The company has added more features to automate data management.
June 17, 2015 · The platform has a handful of user-focused features.
June 16, 2015 · The platform is integrated with NX and can optimize pipe simulation.
June 15, 2015 · The platform can provide electrical and performance characteristics for capacitors.
June 15, 2015 · The software combines MCUs and tools to develop IoT applications.
June 11, 2015 · The software's Questa Simulation Engine now runs up to four times faster.
June 11, 2015 · The company is also working with Dremel to develop a complete scan to print workflow.
June 10, 2015 · HDMXpress can automatically generate tests and auto-calibrate oscilloscopes.
June 10, 2015 · The system has a build envelope of 12.5 x 8 x 10 in.
June 10, 2015 · Enhancements speed design efficiency; company also announces flexible payment options.
June 9, 2015 · The devices are suited for IoT and M2M applications.
June 8, 2015 · The devices cover UHF, VHF, L, S and C frequency bands.
June 8, 2015 · The companies are simplifying the workflow between Creo and the Objet500 Connex system.
June 5, 2015 · This version has added process management and expanded CAE material model support.
June 5, 2015 · The platform has an enhanced user experience and support for Windows 8.1.