DE · Topics · DARPA

DARPA

The Partnership Seeking to Jumpstart Microelectronics Innovation
DARPA’s $200 million JUMP program aims to create a leap forward in U.S. electronics innovation.
ICME Helps Designers Living in a Materials World
The promise and challenges of a systems-level approach to lightweighting.
Supercomputers Lower the Cost of Space Access
DARPA and Department of Defense supercomputers help Masten Space Systems calculate aerodynamic effects on designs for low Earth orbit launchers.
DARPA Advances Prosthetic Research
The agency, in conjunction with Johns Hopkins University, has created a robotic arm that can convert pressure into electric neurotransmissions.
Building Robot First Responders
Behind the scenes at the DARPA Robotics Challenge Finals.
UCLA Develops Energy Efficient Computer Memory
DARPA Seeks Self-Destructing Electronics
DARPA’s Atlas Shoulders the Future of Robot Development
DARPA Robotics Simulation System Available to Public
Robot Hand Can Use Tweezers, Keys
DARPA FANG Winners Announced
DARPA Takes Fresh Look at Vertical Take-Off Plane
DARPA Working Toward Wireless Future


Latest News

Energica Renews Collaboration With Siemens
Siemens will keep supporting Energica via 3D systems simulation and computational fluid dynamics methodologies from Siemens’ Xcelerator portfolio.

Maximize Workforce Efficiency: Using KnowledgeSmart to Identify Skill Gaps
Robust, integrated skill assessments connect your employees with the training that will have the greatest impact.

IronCAD 2024 Product Update 1 Released
IronCAD 2024 Product Update 1 (PU1) brings enhancements and product quality improvements across general modeling, sheet metal design, and collaboration capabilities, company...

CIMdata Promotes Key Personnel
Global PLM strategic management consulting and research firm appoints marketing, consulting, and data governance leaders.

What’s New in Simcenter Reduced Order Modeling?
Simcenter Reduced Order Modeling tool can help users achieve optimal results while simplifying computational processes, Siemens says.

SPEE3D Partners with Education Institute for Cold Spray AM Technology
WarpSPEE3D printer at the Collaborative Operationalized Manufacturing Engineering Training (COMET) Initiative is used for training to print large-scale metal...

All posts