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January 29, 2020 · Fieldscale SENSE is an end-to-end development platform for touch-sensor design and high-accuracy simulation.
January 10, 2020 · Aim is to enhance mobility by redefining design capabilities for complex electronic systems.
December 17, 2019 · New report shows detailed review of numerous industries and a review of the key players and material considerations.
December 6, 2019 · New website to supply and support downloadable SPICE models for analog circuit designers.
December 2, 2019 · Embedded software development consultancy targets struggling electronics design projects with a new rescue engagement.
November 12, 2019 · Proposed working group established to determine industry interest for a standard to support a functional safety flow.
October 14, 2019 · Scanfil will use Siemens Opcenter Execution Electronics (formerly Camstar Electronics Suite) to improve manufacturing processes.
October 11, 2019 · The latest release, Altium Designer 20, offers major upgrades to the software’s unified design environment, user experience and PCB design capabilities.
October 7, 2019 · PWR to explore new thermal management strategies through metal 3D printing across a range of heat exchanger applications in motorsport, battery cell, electronics, aerospace and automotive cooling.
September 16, 2019 · Capacitors 3D printed on the DragonFly system eliminate the need for assembly.
September 5, 2019 · ECSite software solution provides test automation, data management and reporting of 4G/5G telecom infrastructure applications.
August 1, 2019 · Late product introductions and wasted time are a couple of the negative consequences of a problem oft preventable with more proactive bill of materials management practices.
July 26, 2019 · HENSOLDT tests the DragonFly LDM additive manufacturing technology and discusses the results.
July 15, 2019 · IIT is a research institution in Italy specializing in promoting technological development and higher education in science and technology.
July 3, 2019 · Electronics producers are now using the aerosol jet process to print RF interconnects, replace wire bonds in IC packaging, print antennas directly onto electronics enclosures and create multi-layer, miniature circuits.
July 1, 2019 · 6SigmaET has evolved over the last 10 years and now incorporates advanced unstructured gridding technology, cloud-based solving and VR integration for the Oculus Rift.
June 7, 2019 · Latest ANSYS release accelerates digital transformation across every industry.
May 31, 2019 · Nano Dimension and Harris Corporation receive grant approval to create hardware to fly on the International Space Station.
May 1, 2019 · The rise of the Internet of Things, the growing role of printed electronics and the increasing number of technologies that mimic nature have all shaped the system’s development.
April 26, 2019 · New software release extends PLM and quality assurance.
Digital Engineering June 2026
In the latest issue of Digital Engineering, we focus on automotive design innovations, including light and sound simulation, additive manufacturing applications. Our editors head to NVIDIA GTC and RAPID+TCT, and we investigate whether you can…
May 2026 Special Focus: Artificial Intelligence in Design and Simulation
In this Special Focus Issue, learn about the latest developments in the integration of artificial intelligence into engineering workflows.
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