RapidDirect Offers Sheet Metal Instant Quote
March 6, 2024
RapidDirect expands Instant Quotes feature to include sheet metal fabrication on its AI-enabled manufacturing platform.
Striker Introduces STRIKER CAD/CAM 2024
August 25, 2023
STRIKER CAD/CAM provides automated programming of CNC profile cutting and punching equipment, nesting and business system integration.
Lantek Launches EdgeLine Bevel Module
March 31, 2023
The EdgeLine Bevel module powered by Lantek Expert Cut simplifies programming and streamlines CNC programming of modern TRUMPF cutting machines, company says.
Desktop Metal Rolling Out 3D-Printed Sheet Metal Tech for Cars, Planes
September 9, 2022
The technology Figur G15 is reportedly capable of shaping standard sheet metal on demand directly from a digital design file.
Dassault Systèmes and BMW Make Stamping Die Design Application
May 6, 2022
The two companies analyzed how stamped sheet metal parts definition and stamping die design process could be optimized with CATIA applications.
FTI Releases FormingSuite 2019
January 3, 2019
Designed for sheet metal cost estimators, design engineers, tooling designers, and advanced planning engineers in the automotive, aerospace, consumer product and electronics industries, FormingSuite 2019 delivers new customer-driven features.
Editor’s Pick: PAM-STAMP 2018 Debuts
May 2, 2018
ESI says its end-to-end sheet metal forming simulation solution can help engineers realize lightweight designs using innovative materials.
Latest News
NVIDIA AI Summit: AI Powers Everything, from Autonomous Cars to the Search for Alien Life
NVIDIA's Bob Pette credits Tensor Cores and CUDA as the catalysts for AI revolution
MachineWorks and Productive Machines Ink Strategic Partnership
This collaboration aims to introduce efficiency in machining processes, the companies report.
OpenBOM Releases Major Update for Onshape
Look for new drawing features, simplified settings, and enhanced speed, company says.
Altair and Munich Technical School Partner on Quantum Computing
Research details solutions for several key challenges of quantum computing implementation.
@Xi Delivers AI Supercomputer to University of Wyoming
Not counting the CPU nodes, this new supercomputer power reaches up to 6.3 PetaFLOPS FP64/32 peak performance.
Ansys Teams Up with Microsoft and TSMC for Photonic Simulation
Companies collaborate to speed up simulation and analysis of silicon photonic components, according to Ansys.
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