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3D Systems Exhibits AF Technologies

EuroMold 2008 attendees were the first to see some of the latest 3D Systems systems.

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By DE Editors  

December 23, 2008

By DE Editors

3D Systems Corporation (Rock Hill, SC) unveiled and demonstrated for the first time its new high-speed sintering system, the sPro 230 SLS Center, at EuroMold 2008 in Frankfurt, Germany in November.

The sPro 230 SLS Center builds tough, durable parts up to 30 inches long at high speeds.  The company has begun taking orders for the sPro Centers for delivery during the first quarter of 2009.

Also conference attendees were the first to see the ProJet 5000 3-D Production System in operation. This system is the company’s new generation, larger format 3-D Printer that is said to deliver high-definition parts from a variety of plastic and wax materials that can be configured and selected interchangeably. Also making use of 3D Systems’ patented and proprietary Multi-Jet Modeling (MJM) technology, the system includes build resolutions that fit all applications, remote diagnostics for easy serviceability, and a selection of interchangeable plastic and wax material options. 3D Systems will commercialize this system in 2009.

Also demonstrated was 3D Systems’ new iPro 8000 SLA Center. This mid-range system offers the capabilities and benefits of its latest stereolithography technology in a compact footprint and smaller format. Another product shown at the conference was the recently commercialized ProJet CP and CPX RealWax 3D Printers. Designed for producing high definition wax patterns for direct investment casting, these printers shipped during Q4 2008.

Among 3D Systems’ products in advanced marketplace evaluation stages was the V-Flash FTI 230 Desktop Modeler, described as a fast, simple, compact and cost-effective 3-D modeler. Other exhibits showcased newly engineered materials that include VisiJet EX 200 Plastic for high strength 3D printing, Accura ClearVue SLA Plastic for nearly transparent parts, and others.

For further information, visit 3D Systems.

For previous DE coverage, see “Announcements from 3D Systems World Conference,” (Oct. 2008).

Sources: Press materials received from the company and additional information gleaned from the company’s website.

 

About DE Editors

DE Editors

DE's editors contribute news and new product announcements to Digital Engineering. Press releases may be sent to them via [email protected].

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