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ANSYS Releases Ansoft Academic Product Bundle

Designed to prepare engineering students with a commercial-grade electronic design automation portfolio.

By DE Editors  

November 4, 2009

By DE Editors

ANSYS, Inc.’s Ansoft Academic Product bundle is designed for teaching and academic research related specifically to radio frequency (RF) microwave, signal integrity (SI), and electromechanical systems engineering. The bundling concept offers full commercial versions of the Ansoft family of products including HFSS, Ansoft Designer, and Maxwell software.

“There’s no longer the need to choose different product capabilities from a vast list of offerings — the academic software bundle has been uniquely configured to offer everything the college, department, and students require, now, without the need to add other follow-on products later,” said Paul Lethbridge, academic product strategy and planning manager at ANSYS, Inc. “In addition, students and researchers can explore beyond the limited scope of a single product capability. This alone encourages multiphysics, multi-scale thinking, leading to innovation — giving students more real-world experience and, therefore, more value when they move into industry.”

The Ansoft Academic Product offering is now available as two options: high-frequency (HF) and electromechanical (EM). The HF bundle, suitable for high-performance RF, microwave, millimeter-wave device simulation, and signal integrity applications, includes HFSS, Q3D Extractor, Ansoft Designer, and Nexxim technologies. The EM bundle is intended for the design and simulation of motors, actuators, transformers, electromechanical devices, and multi-domain systems that couple thermal, electromechanical, electromagnetic, and hydraulic devices. It includes Maxwell and Simplorer software. Both bundles include Optimetrics technology, parallel processing, and import/connectivity to many MCAD and ECAD tools. An option is available that specifically incorporates the HFSS high-performance computing capability, which allows handling extremely large simulations.

For more information, visit the ANSYS Academic site.

Sources: Press materials received from the company and additional information gleaned from the company's website.

 

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