NEi Software Demonstrating Nastran Simulation at Society of Automotive Engineers' Noise and Vibration Conference

By DE Editors

NEi Software (NEi) will demonstrate NEi Nastran structural analysis software for linear, nonlinear, and dynamic simulation at the Society of Automotive Engineer’s (SAE) Noise and Vibration Conference (Booth 114) in St. Charles IL, May 18-21. 

NEi’s software allows engineers to build digital prototypes to virtually test structures and component parts before physical parts are fabricated. Engineers can also identify problem areas, optimize designs, and reduce time and money spent on prototypes and testing for automotive, aerospace, construction equipment, motorcycle, marine, and recreational vehicles.

NEi Software will be featuring technology in its core finite element analysis (FEA) package, NEi Nastran, along with other engineering software solutions such as Femap by Siemens PLM Software. Technology of interest in these products includes the following features:

• NEi Nastran Editor provides greater control over Nastran FEA models and results. It includes a trade study generator, a basic optimization utility, visualization of results as they are generated during solving, and the ability to change key parameters mid-stream without stopping and restarting the job.
• Vibration fatigue for predicting life, damage and failure due to vibration.
• Automated Surface Contact Generation (ASCG) sets up contact between discontinuous bodies and complex regions with support for legacy Nastran models.
• Automated Edge Contact Generation (AECG) improves productivity for shell type structures by automating connections with separated surfaces and edges and faces.
• Automated Impact Analysis (AIA) provides a simulation of impact by taking into account surface contact, time duration of impact, and the vibration characteristics of the colliding bodies.

For more information, visit NEi Software.

Sources: Press materials received from the company and additional information gleaned from the company’s website.