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Digital Engineering April 2026
In the latest issue of Digital Engineering, we take a look at the latest innovations in design for additive manufacturing, including the use of natural language inputs, social media cosplayers, and AI integration. The issue also includes a feature…
January Special Focus Issue: Design for Additive
In this Special Focus Issue of Digital Engineering, learn about the latest advancements in design for additive manufacturing, including new software tools, additive in automotive, custom medical devices, and more.
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DSM Somos (Elgin, IL) will be introducing a new software application based on patented technology from the Milwaukee School of Engineering (MSOE) that will allow stereolithography (SL) users to create lightweight prototypes with enhanced structural integrity. Application areas such as investment casting patterns, reduced-density metal clad composite structures and lightweight large, thick-sectioned parts may benefit from this software.
TetraShell hollow build software will use MSOE's TetraLattice technology for the manufacture of hollow stereolithography parts with variable skin thicknesses, supported by a patented and proprietary TetraLattice support structure.
SL parts builders will be able to use TetraShell software to vary wall thickness and adjust support parameters in their products. Because the software will reduce the overall mass of parts, customers may expect to save on costs of materials and experience more accuracy in the creation of their parts.
Designed for use on all current SL equipment, the TetraShell software is a proprietary DSM Somos application module supported by Materialise's Magics software. The product is in beta now, with availability of the software in conjunction with Somos resins anticipated for end of 2008.
For more information, visit DSM Somos.
Sources: Press materials received from the company and additional information gleaned from the company’s website.
DE's editors contribute news and new product announcements to Digital Engineering. Press releases may be sent to them via [email protected].
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