Digital Engineering 24/7

Helping design and engineering professionals discover, evaluate and specify technologies and processes that shorten the design cycle and enable success.

Tektronix Announces Test Tools for SuperSpeed USB

Customers gain complete physical layer SuperSpeed USB tests to verify silicon compliance.

Latest Engineering Computing News

Latest Engineering Computing Resources

By DE Editors  

October 21, 2008

By DE Editors

Tektronix, Inc. (Beaverton, OR), a provider of test, measurement and monitoring instrumentation, announced a test set for the USB 3.0 specification. The high-speed serial data offering will enable customers to rapidly test their SuperSpeed USB designs.

It is estimated that initial SuperSpeed USB interface ICs and consumer products should appear in early 2010. The first SuperSpeed USB products will include data-storage devices such as flash drives, external hard drives, digital music players, and digital cameras. These will be followed by video products and eventually data acquisition systems that need the high data throughput.

SuperSpeed USB will join other high-speed serial standards such as 8Gbps PCI-Express and SATA 6Gbps as one of the more demanding technologies, requiring advanced test and measurement instruments such as the industry leading Tektronix DPO/DSA70000 oscilloscope series and analysis software. The Tektronix oscilloscopes can acquire signals up to 8Gbps, at or above the 5th harmonic, enabling greater margin and fidelity for demanding compliance and debug testing.

With the higher bit rate, SuperSpeed USB receivers will also need equalization at the receiver because the signal eye will be closed after traveling through PCB traces, connectors, and cables. This equalization stress testing is facilitated by the Tektronix USB test solution including AWG7000B arbitrary waveform generators and DSA8200 Sampling Oscilloscopes.

For details on what the Tektronix test solution for USB 3.0 includes, go to Tektronix.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

 

About DE Editors

DE Editors

DE's editors contribute news and new product announcements to Digital Engineering. Press releases may be sent to them via [email protected].

Follow DE
on Facebook
on Linkedin

Related Topics

Engineering Computing   News   Products   All topics
 

Subscribe

Subscribe to our FREE magazine, FREE email newsletters or both!

Join over 90,000 engineering professionals who get fresh engineering news as soon as it is published.

Subscribe today

 
 

From our Sponsors

Meltio Takes Metal Additive to the Next Level
Meltio's DED technology enables industries to tailor and customize their solutions to create & repair metal parts.
Easing the Transition from ETO to CTO with Configuration Lifecycle Management
Manufacturers are discovering that the Configure-to-Order (CTO) model provides significant benefits when it comes to customization.
Siemens + Altair = The Next Chapter in Design and Simulation
With its acquisition of Altair, Siemens creates a unified simulation portfolio combining generative design with high-performance computing and AI workflows.