Digital Engineering 24/7

Helping design and engineering professionals discover, evaluate and specify technologies and processes that shorten the design cycle and enable success.

United Electronic Industries Releases PowerDNA Gigabit Ethernet I/O Cube

New, higher speed, cube available in two models.

Latest Engineering Computing News

Latest Engineering Computing Resources

By DE Editors  

April 17, 2009

By DE Editors

United Electronic Industries Releases PowerDNA Gigabit Ethernet I/O Cube

United Electronic Industries (UEI) has released the new PowerDNA PPCx-1G Gigabit Ethernet I/O Cube. Available in two basic models — a 3-I/O layer (5-slot PPC5-1G) or a 6-I/O layer (8-slot PPC8-1G) — the new GigE Cube offers higher speed and enhanced diagnostics capability relative to the standard Cubes, but remains compatible with all 30+ UEI I/O board types.

The 6-layer model (PPC8-1G Cube) can provide up to 150 analog inputs, 192 analog outputs, 288 digital I/O, 48 counter or quadrature channels, 72 ARINC-429 channels and/or 24 Serial or CAN-bus ports.

Software for the GigE Cube is provided in the UEIDAQ Framework. The framework provides an API that supports many programming and operating systems, including Windows Vista, Linux, and most real-time operating systems (e.g., QNX, RTX, RT Linux). In addition, the product is supported by LabVIEW, MATLAB/Simulink, DASYLab, or any application that supports ActiveX, OPC or Modbus TCP control.

For more information, visit UEI.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

 

About DE Editors

DE Editors

DE's editors contribute news and new product announcements to Digital Engineering. Press releases may be sent to them via [email protected].

Follow DE
on Facebook
on Linkedin

Related Topics

Engineering Computing   News   Products   All topics
 

Subscribe

Subscribe to our FREE magazine, FREE email newsletters or both!

Join over 90,000 engineering professionals who get fresh engineering news as soon as it is published.

Subscribe today

 
 

From our Sponsors

Meltio Takes Metal Additive to the Next Level
Meltio's DED technology enables industries to tailor and customize their solutions to create & repair metal parts.
Easing the Transition from ETO to CTO with Configuration Lifecycle Management
Manufacturers are discovering that the Configure-to-Order (CTO) model provides significant benefits when it comes to customization.
Siemens + Altair = The Next Chapter in Design and Simulation
With its acquisition of Altair, Siemens creates a unified simulation portfolio combining generative design with high-performance computing and AI workflows.