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What's New in Simcenter FloTherm Releases

Highlights include material map capabilities for a PCB thermal analysis workflow, PCB thermal via modeling capabilities and more.

What's New in Simcenter FloTherm Releases
Source: Siemens
Release offers faster modeling incorporating the Material Map SmartPart modeling approach. Image courtesy of Siemens.

By DE Editors  

April 12, 2024

The Simcenter Flotherm 2404 and Simcenter Flotherm XT 2404 electronics cooling simulation software releases are now available from Siemens Digital Industries Software.

Simcenter Flotherm 2404

Material Map SmartPart

The Material Map SmartPart in Simcenter Flotherm 2404 electronics cooling software leverages imported Material Map files to enable faster, accurate modeling of modern integrated circuit packages and printed circuit boards compared to typical modeling approaches that consist of thousands of geometric objects.

Simcenter Flotherm XT 2404

Model PCB Thermal Vias

New PCB thermal via modeling capabilities have been added to the Simcenter Flotherm XT EDA Bridge so you can more easily explore thermal management options:

  • Quickly add thermal vias under a component
  • Thermal vias are created as a cuboid representation of an array with orthotropic material properties when transferred to Simcenter Flotherm XT

For greater product detail, click here.

Download Software Releases Now

For existing users, visit these support center links:

Sources: Press materials received from the company and additional information gleaned from the company’s website.

 

More about Siemens Digital Industries Software

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DE's editors contribute news and new product announcements to Digital Engineering. Press releases may be sent to them via [email protected].

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Simulate   Products   Electronics Cooling   New Products   Siemens Digital Industries Software   Simulation   Software   All topics
 

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