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DE Editors · September 3, 2015 · The initiative is to provide access students and professors access to modeFRONTIER.
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DE Editors · September 3, 2015 · The companies are offering a cloud service for 3D print model repair and preparation.
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DE Editors · September 1, 2015 · MAN and the University of Applied Science Upper Austria use ESI Group’s IC.IDO to efficiently create a truck assembly line.
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DE Editors · September 1, 2015 · The Solair application platform at the heart of the new NEMOSY system was developed and patented by DSC Nexus for the large-scale retail trade.
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DE Editors · August 31, 2015 · The company is now offering 28 more directional couplers.
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DE Editors · August 31, 2015 · This release includes enhancements to extend capabilities and features to accommodate new machines.
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DE Editors · August 26, 2015 · The division will help industries such as aerospace, industrial machinery and building products.
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DE Editors · August 25, 2015 · The company will serve the western Pennsylvania and Virginia region.
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DE Editors · August 25, 2015 · The technology offers scalability for small businesses and distributed enterprises.
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DE Editors · August 21, 2015 · The transaction will expand capabilities for CAD part integration and management.
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DE Editors · August 21, 2015 · The collaboration is leveraging security practices and a Silicon-to-Cloud platform.
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DE Editors · August 21, 2015 · The partnership is creating a visual analytics platform.
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DE Editors · August 20, 2015 · The system is designed to help with photovoltaic cells.
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DE Editors · August 20, 2015 · The platform leverages tools from Spatial.
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DE Editors · August 20, 2015 · The company has added two new 150MHz to its offerings.
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DE Editors · August 19, 2015 · The company plans to provide engineering services to industries such as aerospace, medical and hi-tech.
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DE Editors · August 19, 2015 · The new ThinkPads from Lenovo will be available this fall.
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DE Editors · August 19, 2015 · This edition includes more case studies on how engineers are leveraging cloud-based CAE.
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DE Editors · August 19, 2015 · The technology also supports USB 3.1, 3.0 and 3.2 specifications.
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DE Editors · August 19, 2015 · It is compatible with the CubePro printers.
Digital Engineering June 2026
In the latest issue of Digital Engineering, we focus on automotive design innovations, including light and sound simulation, additive manufacturing applications. Our editors head to NVIDIA GTC and RAPID+TCT, and we investigate whether you can…
May 2026 Special Focus: Artificial Intelligence in Design and Simulation
In this Special Focus Issue, learn about the latest developments in the integration of artificial intelligence into engineering workflows.
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